|
English
|
正體中文
|
简体中文
|
0
|
|
???header.visitor??? :
50703247
???header.onlineuser??? :
340
???header.sponsordeclaration???
|
|
|
|
???tair.name??? >
???browser.page.title.author???
|
"nah jae woong"
Showing items 1-2 of 2 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:14:35Z |
Mechanism of electromigration-induced failure in flip-chip solder joints with a 10-mu m-thick Cu under-bump metallization
|
Nah, Jae-Woong; Chen, Kai; Tu, K. N.; Su, Bor-Rung; Chen, Chih |
Showing items 1-2 of 2 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
