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| 臺大學術典藏 |
2020-06-16T06:36:20Z |
Thermal modeling and device oise properties of three-dimensional-SOI technology
|
Chen, T.W.;Chun, J.-H.;Lu, Y.-C.;Navid, R.;Wang, W.;Chen, C.-L.;Dutton, R.W.; Chen, T.W.; Chun, J.-H.; Lu, Y.-C.; Navid, R.; Wang, W.; Chen, C.-L.; Dutton, R.W.; YI-CHANG LU |
| 國立臺灣大學 |
2009 |
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
|
Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W. |
| 臺大學術典藏 |
2009 |
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
|
Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-Chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W.; Chen, Tze Wee; Chun, Jung Hoon; Lu, Yi-chang; Navid, R.; Wang, Wei; Chen, Chang-Lee; Dutton, R.W. |
Showing items 1-3 of 3 (1 Page(s) Totally)
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