臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 1-10 of 23 (3 Page(s) Totally)
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Institution	Date	Title	Author
國立成功大學	2023	Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy; [Sn-Bi-Zn-In 合金の微細構造と機械的特性に対する Bi 含有量の影響]	Nakawaki, H.;Tatsumi, H.;Nitta, S.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H.
國立成功大學	2023	The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy	Nakawaki, H.;Tatsumi, H.;Yang, C.;Lin, S.;Nishikawa, H.
國立成功大學	2023	How to enhance Sn-Bi low-temperature solder by alloying?	Lin, S.-K.;Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.
臺大學術典藏	2022-03-22T08:30:22Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:30:20Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏	2022-03-22T08:27:23Z	Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment	Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
國立成功大學	2022	High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1	Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K.
國立成功大學	2022	Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging	Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K.
國立成功大學	2022	Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu	Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K.
國立成功大學	2022	Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders	Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K.

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