| 國立成功大學 |
2023 |
Effect of Bi content on the microstructure and mechanical properties of Sn-Bi-Zn-In alloy; [Sn-Bi-Zn-In 合金の微細構造と機械的特性に対する Bi 含有量の影響]
|
Nakawaki, H.;Tatsumi, H.;Nitta, S.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2023 |
The Influence of Bi Content on Joint Properties Using Sn-Bi-Zn-In Alloy
|
Nakawaki, H.;Tatsumi, H.;Yang, C.;Lin, S.;Nishikawa, H. |
| 國立成功大學 |
2023 |
How to enhance Sn-Bi low-temperature solder by alloying?
|
Lin, S.-K.;Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H. |
| 臺大學術典藏 |
2022-03-22T08:30:22Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment
|
Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO |
| 國立成功大學 |
2022 |
High-strength Sn–Bi-based low-temperature solders with high toughness designed via high-throughput thermodynamic modelling1
|
Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging
|
Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu
|
Nishikawa, H.;Hirata, Y.;Yang, C.-H.;Lin, S.-K. |
| 國立成功大學 |
2022 |
Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders
|
Yang, C.-H.;Liu, Y.-C.;Hirata, Y.;Nishikawa, H.;Lin, S.-K. |
| 國立成功大學 |
2021 |
Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In
|
Hirata, Y.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H. |
| 臺大學術典藏 |
2020-05-12T02:53:41Z |
Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose
|
Chou, T.-T.; Tuan, W.-H.; Nishikawa, H.; Weng, B.-J.; WEI-HSING TUAN |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 國立成功大學 |
2019 |
The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
|
Zhou, S.;Yang, C.-H.;Shen, Y.-A.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
|
Shen, Y.-A.;Zhou, S.;Li, J.;Yang, C.-H.;Huang, S.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
|
Zhou, S.;Yang, C.-H.;Lin, S.-K.;AlHazaa, AlHazaa A.N.;Mokhtari, O.;Liu, X.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Development of Sn-Bi-In-Ga quaternary low-Temperature solders
|
Yang, C.-H.;Zhou, S.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
The study of Sn-45Bi-2.6Zn alloy before and after thermal aging
|
Zhou, S.;Yang, C.-H.;Shen, Y.-A.;Lin, S.-K.;Nishikawa, H. |
