|
English
|
正體中文
|
简体中文
|
Total items :2875274
|
|
Visitors :
54500919
Online Users :
2082
Project Commissioned by the Ministry of Education
Project Executed by National Taiwan University Library
|
|
|
|
Taiwan Academic Institutional Repository >
Browse by Author
|
"nishikawa h"
Showing items 11-20 of 23 (3 Page(s) Totally)
<< < 1 2 3 > >>
View [10|25|50] records per page
| 國立成功大學 |
2021 |
Improvements in mechanical properties of Sn–Bi alloys with addition of Zn and In
|
Hirata, Y.;Yang, C.-H.;Lin, S.-K.;Nishikawa, H. |
| 臺大學術典藏 |
2020-05-12T02:53:41Z |
Brazing Graphite to Aluminum Nitride for Thermal Dissipation Purpose
|
Chou, T.-T.; Tuan, W.-H.; Nishikawa, H.; Weng, B.-J.; WEI-HSING TUAN |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:21Z |
Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-Silver Joint
|
C. ROBERT KAO;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
Development of Low-Temperature, Pressureless Copper-to-Copper Bonding by Microfluidic Electroless Interconnection Process
|
C. ROBERT KAO;Kao C.R.;Nishikawa H.;Hung H.-T.;Yang S.; Yang S.; Hung H.-T.; Nishikawa H.; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 臺大學術典藏 |
2019-11-27T02:02:17Z |
High reliability sintered silver-indium bonding with anti-oxidation property for high temperature applications
|
C. ROBERT KAO;Lee C.C.;Nishikawa H.;Kao C.R.;Yang C.A.; Yang C.A.; Kao C.R.; Nishikawa H.; Lee C.C.; C. ROBERT KAO |
| 國立成功大學 |
2019 |
The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength
|
Zhou, S.;Yang, C.-H.;Shen, Y.-A.;Lin, S.-K.;Nishikawa, H. |
| 國立成功大學 |
2019 |
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
|
Shen, Y.-A.;Zhou, S.;Li, J.;Yang, C.-H.;Huang, S.;Lin, S.-K.;Nishikawa, H. |
Showing items 11-20 of 23 (3 Page(s) Totally)
<< < 1 2 3 > >>
View [10|25|50] records per page
|
