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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-16T06:15:24Z |
HIGH FREQUENCY FLIP CHIP PACKAGE STRUCTURE OF POLYMER SUBSTRATE
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-16T06:14:18Z |
High frequency flip chip package process of polymer substrate and structure thereof
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Chang Edward-yi; Hsu Li-Han; Oh Chee-Way; Wu Wei-Cheng; Wang Chin-te |
| 國立交通大學 |
2014-12-12T01:16:31Z |
利用低成本高分子基板結合覆晶封裝技術之高頻及機械特性之探討
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胡志偉; Oh Chee Way; 張翼; Edward Yi Chang |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
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Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
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