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Showing items 11-21 of 21  (1 Page(s) Totally)
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Institution Date Title Author
國立臺灣海洋大學 2008-03 Hydrogen Bubbles and the Growth Morphology of Ramified Zinc by Electrodeposition Liu-Wen Ch; P. C. Hsu; S. K. Seol; T. N. Lo; Chi-Jen Liu; Cheng-Liang Wang; Chao-Sung Lin; Y. Hwu; Chih-Hsiung Chen
國立中山大學 2005 Electronic and local atomic structures of (La1-xPrx)0.85Zr0.15MnO3 studied by x-ray absorption spectroscopy K.P. Krishna Kumar;J.W. Chiou;H.M. Tsai;C.W. Pao;J.C. Jan;P.C. Hsu;D.C. Ling;F.Z. Chien;W.F. Pong;M.H. Tsai;J.F. Lee
國立臺灣海洋大學 2004-12 Imaging Cells in Tissues with Refractive Index Radiology G.M. Chow; Y. Hwu; W. L. Tsai; H. M. Chang; H. I. Yeh; P.C. Hsu; Y. C. Yang; Y. T. Su; H.L.Tsai
國立臺灣海洋大學 2004-02 Coherent Microradiology observes a Critical Cathode-Anode Distance Effect in Localized Electrochemical Deposition (LECD) G. Margaritondo; S. K. Seol; J. M. Yi; x. Jin; C. C. Kim; J. H. Je; W. L. Tsai; P. C. Hsu; Y. Hwu; C. H. Chen; L. W. Chang
國立中山大學 2004 Coherent Microradiology observes a Critical Cathode-Anode Distance Effect in Localized Electrochemical Deposition (LECD) K. Seol;J.M. Yi;x. Jin;C.C. Kim;J.H. Je;W.L. Tsai;P.C. Hsu;Y. Hwu;C.H. Chen;L.W. Chang;G. Margaritondo
國立中山大學 2003 Real Time Observation of Zn Electro-deposition with High Resolution Microradiology W.L. Tsai;P.C. Hsu;Y. Hwu;C.H. Chen;L.W. Chang;J.H. Je;G. Margaritondo
國立臺灣海洋大學 2002-02 Electrochemistry: building on bubbles in metal electrodeposition. G. Margaritondo; W. L. Tsai; P.C. Hsu; Y. Hwu; C.H. Chen; L.W. Chang; H.M. Lin; J. H. Je; A. Groso
國立中山大學 2002 Building on Bubbles in Metal Electrodeposition W.L. Tsai;P.C. Hsu;Y. Hwu;C.H. Chen;L.W. Chang;J.H. Je;H.M. Lin;A. Groso;G. Margaritondo
國立中山大學 2001 Annealing Behavior of Nickel Electrodeposited from Sulfamate Bath at Different Temperatures C.S. Lin;P.C. Hsu;K.C. Peng;L. Chang;C.H. Chen
國立中山大學 2001 Properties and Microstructure of Nickel Electrodeposited From A Sulfamate Bath Containing Ammonium Ions C.S. Lin;P.C. Hsu;L. Chang;C.H. Chen
國立中山大學 2000 Effect of Bath Temperature on Microstructure of Sulfamate Nickel Electrodeposits C.S. Lin;K.C. Peng;P.C. Hsu;L. Chang;C.H. Chen

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