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Showing items 1-10 of 16  (2 Page(s) Totally)
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Institution Date Title Author
元智大學 May-23 Electromigration-induced Remarkable Intermetallic Compound (IMC) Formation in Micro Joints and Its Prevention P. T. Lee; C. Y. Lee; W. Z. Hsieh; C. T. Chen; Cheng-En Ho
元智大學 May-20 Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations Cheng-En Ho; C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee
元智大學 May-20 Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations C. H. Yang; Y. W. Lee; C. Y. Lee; P. T. Lee; Cheng-En Ho
元智大學 Mar-21 IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique Cheng-En Ho; S. P. Yang; P. T. Lee; C. Y. Lee; C. C. Chen; T. T. Kuo
元智大學 Mar-16 Real-time X-ray microscopy study of electromigration in microelectronic solder joints Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學 Mar-16 Real-time X-ray microscopy study of electromigration in microelectronic solder joints Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學 Mar-16 Real-time X-ray microscopy study of electromigration in microelectronic solder joints Cheng-En Ho; C. H. Yang; P. T. Lee; C. T. Chen
元智大學 Jul-21 Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; Y. H. Huang; C. Y. Chiang; C. S. Ku; C. R. Kao; Cheng-En Ho
元智大學 2021/5/12 White X-ray Nanodiffraction Study of Allotropic Phase Transformation of Hexagonal- into Monoclinic-Cu6Sn5 P. T. Lee; W. Z. Hsieh; C. Y. Lee; C. R. Kao; Cheng-En Ho
元智大學 2021/11/13 COMSOL-Multiphysics Simulation of Current Density and Electrolyte Distributions in Cu Pillar Fabrication P. T. Lee; C. H. Chang; C. Y. Lee; Y. L. Chen; Cheng-En Ho

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