臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
國立中山大學	2004	CMP of Ultra Low-k Material Porous-Polysilazane (PPSZ) for Interconnect Applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學	2004	CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學	2004	CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學	2004	A novel distributed charge storage with GeO2 nano-dots	T.C. Chang;S.T. Yan;P.T. Liu;C.H. Hsu;M.T. Tang;S.M. Sze
國立中山大學	2004	Extraction of electrical mechanisms of low-dielectric constant material MSZ for interconnect applications	T.C. Chang;S.T. Yan;P.T. Liu;H. Aoki;S.M. Sze
國立中山大學	2004	Structrual characteristics and interfacial reactions of low dielectric constant porous polysilazane for Cu metallization	J.H. Wang;P.T. Liu;T.C. Chang;L.J. Chen
國立中山大學	2004	CMP of ultra low-k Methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學	2004	Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integraged interconnect application	T.C. Chang;T.M. Tsai;P.T. Liu;Y.C. Chang;J. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學	2004	Quasisuperlattice storage: A concept of multilevel charge stoage	T.C. Chang;S.T. Yan;P.T. Liu;C.W. Chen;H.H. Wu;S.M. Sze
國立中山大學	2004	Cu-penetration induced breakdown mechanism for a-SiCN	C.W. Chen;P.T. Liu;T.C. Chang;J.H. Yang;T.M. Tsai;H.H. Wu;T.Y. Tseng

Showing items 66-75 of 96 (10 Page(s) Totally)
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