臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

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Institution	Date	Title	Author
國立交通大學	2014-12-08T15:11:14Z	Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration	Liang, S. W.; Chang, Y. W.; Chen, Chih; Preciado, Jackie; Tu, K. N.

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