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Institution Date Title Author
國立成功大學 2024-12 Air-sintered copper-nickel resistor with aluminum layer for oxidation prevention Lee;Wen-Hsi;Chang;S, W.;Puteri;Gharini, Narendra
國立成功大學 2024-07 Characteristic of CuMn Alloy Films Prepared Using Electrochemical Deposition Lee;Wen-Hsi;Puteri;Gharini, Narendra;Kuo;C, R.
國立成功大學 2023-12 Studies on Ni termination of a multilayer ceramic capacitor with high capacitance by using DC electrodeposition Lee;Wen-Hsi;Puteri;Gharini, Narendra;Lee;Jason;Lee;C, T.
國立成功大學 2023-09 INCREASING THE CONDUCTIVITY OF SINTERED POWDER AL - CU MATERIAL DUE TO ELECTROPLATING OF ALUMINIUM PARTICLES WITH COPPER Puteri;N, G.;Yu;Y, W.;Lee;W, H.
國立成功大學 2023-06 Thick film of modified aluminum with conductivity similar to silver Lee;Wen-Hsi;Puteri;Gharini, Narendra;Kuo;C, R.
國立成功大學 2023--AUG Characteristic of CuMn Alloy Films Prepared Using Electrochemical Deposition Lee;Wen-Hsi;Puteri;Gharini, Narendra;Kuo;C, R.

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