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Institution	Date	Title	Author
南台科技大學	2006	Failure Mechanism of Electromigration (EM) in Via Sidewall for Copper Dual Damascene Interconnection	Y. L.Hsu; Y. K. Fang; Y. T. Chiang; S.F. Chen; C. Y Lin.; T. H. Chou; S. H. Chang；陳世芳

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