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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
臺大學術典藏 2022-03-22T08:30:22Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:22Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:20Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:30:20Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO
臺大學術典藏 2022-03-22T08:27:23Z Low-pressure micro-silver sintering with the addition of indium for high-temperature power chips attachment Tsai C.-H;Huang W.-C;Chew L.M;Schmitt W;Li J;Nishikawa H;Kao C.R.; Tsai C.-H; Huang W.-C; Chew L.M; Schmitt W; Li J; Nishikawa H; Kao C.R.; C. ROBERT KAO

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