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Showing items 1-8 of 8 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:49:13Z |
Parameter extraction of resistive thermal microsensors by AC electrical method
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Ou-Yang, M; Sheen, CS; Shie, JS |
| 國立交通大學 |
2014-12-08T15:46:44Z |
A novel transient simulation for 3-D multilevel interconnections on complex topography
|
Hou, HM; Sheen, CS; Wu, CY |
| 國立交通大學 |
2014-12-08T15:44:30Z |
A new process technique for complementary metal-oxide-semiconductor [CMOS] compatible sensors
|
Sheen, CS; Chi, S |
| 國立交通大學 |
2014-12-08T15:27:33Z |
Analysis of optimal bolometer sensitivity with linear approximation
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Shie, JS; Chen, YM; Sheen, CS |
| 國立交通大學 |
2014-12-08T15:27:23Z |
Parameter extraction of resistive thermal microsensors by AC electrical method
|
Mang, OY; Sheen, CS; Shie, JS |
| 國立交通大學 |
2014-12-08T15:27:08Z |
A highly sensitive CMOS compatible thermal-type microsensor
|
Sheen, CS; Chen, CN |
| 國立交通大學 |
2014-12-08T15:26:57Z |
A new fiber-communication miniature sensor module
|
Sheen, CS; Chi, S |
| 國立交通大學 |
2014-12-08T15:01:09Z |
A novel modeling technique for efficiently computing 3-D capacitances of VLSI multilevel interconnections BFEM
|
Hou, HM; Sheen, CS; Wu, CY |
Showing items 1-8 of 8 (1 Page(s) Totally)
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