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Institution	Date	Title	Author
義守大學	2017-07	Digital games for learning energy conservation: A study of impacts on motivation, attention, and learning outcomes	Szu-Wei Chen;Chih-Hui Yang;Keng-Shiang Huang;Shen-Li Fu
義守大學	2017-04	An investigation on ultrathin wafer dicing by ultrafast laser with high density plasma etching	Shih-jeh Wu;Hsiang-Chen Hsu;Wen-Fei Lin;Shen-Li Fu
義守大學	2016-07	The Application of General Homotopy Method on Planar Four-Bar Path Synthesis	Pei-chieh Chin;Hsiang-chen Hsu;Shen-li Fu
義守大學	2016-04	Reliability design on wearable device for initial osteoarthritis (OA) on knee joints	Hsiang-Chen Hsu;Pin-Chieh Wang;Jia-Jung Wang;Shen-Li Fu
義守大學	2015-12	Loopback test for 3D stacked integrated circuits	Yu-Jung Huang;Yan-Cen Liu;Shen-Li Fu
義守大學	2015-10	Fabrication and characterization of ultrathin fine-pitch flexible polyimide interposer	Wei-Han Huang;Chun-Yi Wang;Yu-Jung Huang;Shen-Li Fu
義守大學	2015-07	Fabrication and characterization of low-cost ultrathin flexible polyimide interposer	Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2015-04	Internal patterning of the glass backlight module for LCD panel by laser	Shih-Jeh Wu;Hsiang-Chen Hsu;Pin-Chieh Wang;Shen-Li Fu
義守大學	2015-02	Fabrication of Micro-Pattern on Flexible Substrate Using Pulsed Electroplating Techniques	Yu-Jung Huang;Wei-Han Huang;Shen-Li Fu
義守大學	2014-10	Fabrication of fine pitch copper patterns on flexible substrate	Wei-Han Huang;Kai Wei Yang;Yu-Jung Huang;Shen-Li Fu
義守大學	2014-10	An experimental study on dicing 28 nm low-k water using laser grooving technique	Hsiang-Chen Hsu;Cheng-Jiun Han;Li-Ming Chu;Shih-Jeh Wu;Chih-Chiang Fu;Shen-Li Fu;Baojun Liu;Chen-Yi Wang;PoChun Jung
義守大學	2014-10	Cutting PCB with a 532nm DPSS green laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Chih-Chiang Fu;Li-Ming Chu;Shen-Li Fu;Trong-Tai Nguyen
義守大學	2014-03	Numerical simulation of high power LED heat-dissipating system	Shih-Jeh Wu;Hsiang-Chen Hsu;Shen-Li Fu;Jiam-Nan Yeh
義守大學	2014-02	Failure analysis of EOS-induced damage at final electrical testing	Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
義守大學	2014-01	Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads	Shen-Li Fu;Hsiang-Chen Hsu;Yue-Min Wan;Chi-Hau Haung
義守大學	2013-12	Application of a Flow Type Quartz Crystal Microbalance Immunosensor for Detection of Cartilage Oligomeric Matrix Protein and α1-Antitrypsin	Chi-Yen Shen;Yu-Chen Chiu;Ke-Nung Huang;Shen-Li Fu;Rey-Chue Hwang
義守大學	2013-10	Thermal design for high power arrayed LED heat-dissipating system	Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學	2013-10	Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis	Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學	2013-10	An investigation on nanoscale bondability between Cu-Al intermetallic compound	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學	2013-09	Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective	Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學	2013-07	A wireless system for measuring the vibration signals generated by knee joints	Jia-Jung Wang;Chun-Chien Chen;Shin-Hong Liu;Cheng-Yo Yen;Yuan-Kun Tu;Shen-Li Fu
義守大學	2013-07	Temperature feedback based heating strategy for ultrasound thermal surgery	Kuen-Cheng Ju;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-12	Implementing Cloud Technology Of NETPAW at I-Shou University	I-Lin Fu;Yuangshan Chuang;Shen-Li Fu;Robert Beasley
義守大學	2012-12	An investigation on secondary EFO copper wire - from a nanoscale perspective view	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
義守大學	2012-10	Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation	Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-04	Electronics Packaging Technology Research and Development in Taiwan	Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2012-02	The Perspectives of 3D IC Technology in Taiwan	Shen-Li Fu;Wei-Chung Lo;Ray-Lin Yang
義守大學	2011-11	Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates	Chung-Ming Wu;Shui-Hsiang Su;Hong-Tai Wang;Meiso Yokoyama;Shen-Li Fu
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Study of high dielectric constant capacitors on flexible substrates	Hung-Ming Chang;Meng-Lun Wu;Lih-Shan Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-09	Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings	Chih-Feng Wang;Wei-Yan Chen;Huy-Zu Cheng;Shen-Li Fu
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009-10	Floor plan design for 3D multi-layer substrate	Ching-Mai Ko;Yu-Jung Huang;Shen-Li Fu
義守大學	2009-10	Welcome message from Shen-Li Fu, conference co-chair	Shen-Li Fu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-03	Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array	Hsien-Chiao Teng;Yen-ting Yang;Shen Cherng;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh

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