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Showing items 66-90 of 116  (5 Page(s) Totally)
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Institution Date Title Author
義守大學 2007/11/19 Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2007/10/01 Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2007-11 Study of contact degradation in final testing for BGA socket Hsien-Chiao Teng;Ming-Kun Chen;Chia-Hao Yen;Yu-Jung Huang;Shen-Li Fu
義守大學 2007-11 Planar antennas on flexible substrate for wireless applications Hsien-Chiao Teng;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學 2007-11 Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學 2007-09 A Miniaturized Bandpass Filter Fabricated on High Dielectric Constant Ceramic Substrates Ming-Liang Hsieh;Tsung-Hui Huang;Lih-Shan Chen;Chian-Hao Sun;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學 2007-08 Multilayer cross-coupled resonator bandpass filters fabricated on low temperature cofired ceramic substrates Ming-Liang Hsieh;Tsung-Hui Huang;Lih-Shan Chen;Chian-Hao Sun;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學 2007-04 Fabrication of amorphous silicon films for arrayed waveguide grating application Wen-Jen Liu;Steven Chen;Hsin-Yen Cheng;Jyung-Dong Lin;Shen-Li Fu
義守大學 2007 Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學 2006/12/11 Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu
義守大學 2006/08/26 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學 2006/08/26 A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學 2006-12 Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu
義守大學 2006-12 A study on the conductive behavior of copper filled pastes for microelectronic packaging substrates Yung-Ssen Lin; Sheng-Shiang Chiu; Chi-Shung Shi; Shen-Li Fu
義守大學 2006-12 Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu
義守大學 2006-12 Suppression of Spurious Resonance by Using Multistep Transmission Lines Wen-Tsung Luo; Wen-Jeng Lin; Kuan-Te Lee; Lih-Shan Chen; Shen-Li Fu
義守大學 2006-12 Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates Ming-Liang Hsieh;Lih-Shan Chen;Shuming Wang;Shen-Li Fu
義守大學 2006-12 Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates Ming-Liang Hsieh;Lih-Shan Chen';Shuming Wang;Shen-Li Fu
義守大學 2006-08 A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學 2006-08 Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學 2006-06 Fabrication of amorphous silicon films for arrayed waveguide grating application Wen-Jen Liu;Steven Chen;Hsin-Yen Cheng;Jyung-Dong Lin;Shen-Li Fu
義守大學 2005-12 Reliability and thermal structure design for CMOS image sensor Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang
義守大學 2005-07 Low-Temperature Sintering of Microwave Dielectrics (Zn,Mg)TiO3 Ming-Liang Hsieh; Lih-Shan Chen; Shu-Ming Wang; Chian-Hao Sun; Min-Hung Weng; Mau-Phon Houng ; Shen-Li Fu
義守大學 2005 Processing and shape effects on silver paste electrically conductive adhesives (ECAs) Huann-Wu Chiang; Cho-Liang Chung;markchun; Liu-Chin Chen; Yi Li; Wong, C. P.; Shen-Li Fu
義守大學 2005 Processing and shape effects on silver paste electrically conductive adhesives (ECAs) Huann-Wu Chiang;Cho-Liang Chung;Liu-Chin Chen;Yi Li;C. P. Wong;Shen-Li Fu

Showing items 66-90 of 116  (5 Page(s) Totally)
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