English  |  正體中文  |  简体中文  |  总笔数 :2856704  
造访人次 :  53724436    在线人数 :  869
教育部委托研究计画      计画执行:国立台湾大学图书馆
 
臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
关于TAIR

浏览

消息

著作权

相关连结

"shen li fu"的相关文件

回到依作者浏览
依题名排序 依日期排序

显示项目 31-55 / 116 (共5页)
<< < 1 2 3 4 5 > >>
每页显示[10|25|50]项目

机构 日期 题名 作者
義守大學 2011-11 Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates Chung-Ming Wu;Shui-Hsiang Su;Hong-Tai Wang;Meiso Yokoyama;Shen-Li Fu
義守大學 2011-10 Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學 2011-10 An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學 2011-10 A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學 2011-06 Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學 2010-12 Advanced Finite Element Model on Copper Wire Ball Bonding Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學 2010-10 Study of high dielectric constant capacitors on flexible substrates Hung-Ming Chang;Meng-Lun Wu;Lih-Shan Chen;Yu-Jung Huang;Shen-Li Fu
義守大學 2010-10 Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學 2010-09 Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings Chih-Feng Wang;Wei-Yan Chen;Huy-Zu Cheng;Shen-Li Fu
義守大學 2010-08 Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學 2009/10/21 Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP) Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學 2009-10 Floor plan design for 3D multi-layer substrate Ching-Mai Ko;Yu-Jung Huang;Shen-Li Fu
義守大學 2009-10 Welcome message from Shen-Li Fu, conference co-chair Shen-Li Fu
義守大學 2009-10 Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP) Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學 2009-10 Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學 2009-03 Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array Hsien-Chiao Teng;Yen-ting Yang;Shen Cherng;Yu-Jung Huang;Shen-Li Fu
義守大學 2008/12/09 Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學 2008/10/22 Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學 2008/10/22 Fabrication and characterization of passive devices on flexible substrates Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學 2008/10/22 An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學 2008/01/24 Experimental approach to analyze failure site condition in final testing of bga package Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學 2008-12 Application of organic thin film parasitic to patch antenna Hsien-Chiao Teng;Shen Cherng;Anchi Yeh;Yu-Jung Huang;Shen-Li Fu
義守大學 2008-12 Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學 2008-11 Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3 Ming-Liang Hsieh;Lih-Shan Chen;Hsiang-Chen Hsu;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學 2008-10 Fabrication and characterization of passive devices on flexible substrates Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu

显示项目 31-55 / 116 (共5页)
<< < 1 2 3 4 5 > >>
每页显示[10|25|50]项目