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机构	日期	题名	作者
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009-10	Floor plan design for 3D multi-layer substrate	Ching-Mai Ko;Yu-Jung Huang;Shen-Li Fu
義守大學	2009-10	Welcome message from Shen-Li Fu, conference co-chair	Shen-Li Fu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-03	Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array	Hsien-Chiao Teng;Yen-ting Yang;Shen Cherng;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Application of organic thin film parasitic to patch antenna	Hsien-Chiao Teng;Shen Cherng;Anchi Yeh;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2008-11	Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3	Ming-Liang Hsieh;Lih-Shan Chen;Hsiang-Chen Hsu;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008-10	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-10	Effect of process parameters on the growth and properties of impurity-doped zinc oxide transparent conducting thin films by RF magnetron sputtering	Boen Houng; Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-10	Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008-09	Effect of Ru addition on the properties of Al-doped ZnO thin films prepared by radio frequency magnetron sputtering on polyethylene terephthalate substrate	Chi Shiung Hsi;Boen Houng;Bing Yi Hou;Guo Ju Chen;Shen Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-05	Fabrication and properties evaluation of aluminum and ruthenium co-doped zinc oxide thin films	Boen Houng;Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-04	Harmonic suppression of bandpass filters using open-circuited stubs	Lih-Shan Chen;Wen-Jeng Lin;Tsung-Hui Huang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008	Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh
義守大學	2008	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu

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