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機構	日期	題名	作者
義守大學	2012-10	Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation	Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-04	Electronics Packaging Technology Research and Development in Taiwan	Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2012-02	The Perspectives of 3D IC Technology in Taiwan	Shen-Li Fu;Wei-Chung Lo;Ray-Lin Yang
義守大學	2011-11	Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates	Chung-Ming Wu;Shui-Hsiang Su;Hong-Tai Wang;Meiso Yokoyama;Shen-Li Fu
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Study of high dielectric constant capacitors on flexible substrates	Hung-Ming Chang;Meng-Lun Wu;Lih-Shan Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-09	Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings	Chih-Feng Wang;Wei-Yan Chen;Huy-Zu Cheng;Shen-Li Fu
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009-10	Floor plan design for 3D multi-layer substrate	Ching-Mai Ko;Yu-Jung Huang;Shen-Li Fu
義守大學	2009-10	Welcome message from Shen-Li Fu, conference co-chair	Shen-Li Fu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-03	Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array	Hsien-Chiao Teng;Yen-ting Yang;Shen Cherng;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Application of organic thin film parasitic to patch antenna	Hsien-Chiao Teng;Shen Cherng;Anchi Yeh;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2008-11	Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3	Ming-Liang Hsieh;Lih-Shan Chen;Hsiang-Chen Hsu;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008-10	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-10	Effect of process parameters on the growth and properties of impurity-doped zinc oxide transparent conducting thin films by RF magnetron sputtering	Boen Houng; Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-10	Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008-09	Effect of Ru addition on the properties of Al-doped ZnO thin films prepared by radio frequency magnetron sputtering on polyethylene terephthalate substrate	Chi Shiung Hsi;Boen Houng;Bing Yi Hou;Guo Ju Chen;Shen Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-05	Fabrication and properties evaluation of aluminum and ruthenium co-doped zinc oxide thin films	Boen Houng;Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-04	Harmonic suppression of bandpass filters using open-circuited stubs	Lih-Shan Chen;Wen-Jeng Lin;Tsung-Hui Huang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008	Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh
義守大學	2008	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu
義守大學	2007/11/19	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007-11	Study of contact degradation in final testing for BGA socket	Hsien-Chiao Teng;Ming-Kun Chen;Chia-Hao Yen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Planar antennas on flexible substrate for wireless applications	Hsien-Chiao Teng;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2007-09	A Miniaturized Bandpass Filter Fabricated on High Dielectric Constant Ceramic Substrates	Ming-Liang Hsieh;Tsung-Hui Huang;Lih-Shan Chen;Chian-Hao Sun;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2007-08	Multilayer cross-coupled resonator bandpass filters fabricated on low temperature cofired ceramic substrates	Ming-Liang Hsieh;Tsung-Hui Huang;Lih-Shan Chen;Chian-Hao Sun;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2007-04	Fabrication of amorphous silicon films for arrayed waveguide grating application	Wen-Jen Liu;Steven Chen;Hsin-Yen Cheng;Jyung-Dong Lin;Shen-Li Fu
義守大學	2007	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin; Chin-Yuan Hu; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2006/12/11	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu ; Yu-Chia Hsu ; Hm-Yu Lee ; Chang-Lin Yeh ; Yi-Shao Lai ; Shen-Li Fu

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