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機構	日期	題名	作者
義守大學	2006/08/26	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu ; Shen-Wen Yu ; Yu-Teng Hsu ; Wei-Yaw Chang ; Ming-Jer Lin ; Ruei-Ming Lin ; Pei-Chieh Chin ; Hung-Chun Ho ; Ming-Cheng Lu ; Cheng-Tung Lee ; Chin-Liang Chen ; Chien-Hung Liao ; Yu-Jung Huang ; Shen-Li Fu ; Li-Shan Chen
義守大學	2006/08/26	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu ; Hui-Yu Lee ; Yu-Chia Hsu ; Chin-Yuan Hu ; Ming-Jer Lin ; Pei-Chieh Chin ; Shen-Li Fu ; Chung, M.C.L. ; Ching-Chung Tseng
義守大學	2006-12	Electrical Modeling and Circuit Simulation for SI Analysis of High-Speed FC-BGA	Ming-Kun Chen;Yu-Jung Huang;Shu-Jung Hou;Yu-Hung Chen;Chien-Kai Yang;Shen-Li Fu
義守大學	2006-12	A study on the conductive behavior of copper filled pastes for microelectronic packaging substrates	Yung-Ssen Lin; Sheng-Shiang Chiu; Chi-Shung Shi; Shen-Li Fu
義守大學	2006-12	Finite Element Analysis of Dynamic Drop Impact of Board-level Stacked-Die Packages Using Submodeling Technique	Hsiang-Chen Hsu; Yu-Chia Hsu; Hm-Yu Lee; Chang-Lin Yeh; Yi-Shao Lai; Shen-Li Fu
義守大學	2006-12	Suppression of Spurious Resonance by Using Multistep Transmission Lines	Wen-Tsung Luo; Wen-Jeng Lin; Kuan-Te Lee; Lih-Shan Chen; Shen-Li Fu
義守大學	2006-12	Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates	Ming-Liang Hsieh;Lih-Shan Chen;Shuming Wang;Shen-Li Fu
義守大學	2006-12	Microstrip Cross-coupled Trisection Bandpass Filters Fabricated on High Dielectric Constant Ceramic Substrates	Ming-Liang Hsieh;Lih-Shan Chen';Shuming Wang;Shen-Li Fu
義守大學	2006-08	A Novel Submodeling Scheme on Thermal Cycle Test for CMOS Image Sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Chin-Yuan Hu; Ming-Jer Lin; Pei-Chieh Chin; Shen-Li Fu; Chung, M.C.L.; Ching-Chung Tseng
義守大學	2006-08	Parametric Study and Optimal Design in Wire Bonding Process for Mini Stack-Die Package	Hsiang-Chen Hsu;Shen-Wen Yu;Yu-Teng Hsu;Wei-Yaw Chang;Ming-Jer Lin;Ruei-Ming Lin;Pei-Chieh Chin;Hung-Chun Ho;Ming-Cheng Lu;Cheng-Tung Lee;Chin-Liang Chen;Chien-Hung Liao;Yu-Jung Huang;Shen-Li Fu;Li-Shan Chen
義守大學	2006-06	Fabrication of amorphous silicon films for arrayed waveguide grating application	Wen-Jen Liu;Steven Chen;Hsin-Yen Cheng;Jyung-Dong Lin;Shen-Li Fu
義守大學	2005-12	Reliability and thermal structure design for CMOS image sensor	Hsiang-Chen Hsu; Hui-Yu Lee; Yu-Chia Hsu; Shen-Li Fu; Chung-Chi Yang; Kuan-Chieh Huang
義守大學	2005-07	Low-Temperature Sintering of Microwave Dielectrics (Zn,Mg)TiO3	Ming-Liang Hsieh; Lih-Shan Chen; Shu-Ming Wang; Chian-Hao Sun; Min-Hung Weng; Mau-Phon Houng ; Shen-Li Fu
義守大學	2005	Processing and shape effects on silver paste electrically conductive adhesives (ECAs)	Huann-Wu Chiang; Cho-Liang Chung;markchun; Liu-Chin Chen; Yi Li; Wong, C. P.; Shen-Li Fu
義守大學	2005	Processing and shape effects on silver paste electrically conductive adhesives (ECAs)	Huann-Wu Chiang;Cho-Liang Chung;Liu-Chin Chen;Yi Li;C. P. Wong;Shen-Li Fu
義守大學	2003-02	Processing of LTCC with embedded RuO2-based resistors	Chi-Shiung Hsi;De-Fuang Chen;Fang-Min Shieh;Shen-Li Fu
義守大學	2003	Research and development of electronic packaging technology in Taiwan	Shen-Li Fu; Rong-Shen Lee; Chen, T.
義守大學	2002-05	Electrical properties of Al2O3- and MnO2-doped thick film resistors on AlN substrates	Lih-Shan Chen;Shen-Li Fu;Jun-Hong Wu
義守大學	2002-01	Reliability and routability consideration for MCM placement	Yu-Jung Huang;Mei-Hui Guo;Shen-Li Fu
國立中山大學	2002	Reliability and routability consideration for MCM placement	Yu-Jung Huang; Mei-Hui Guo; Shen-Li Fu
義守大學	2001-10	Fuzzy thermal modeling for MCM placement	Yu-Jung Huang;Shen-Li Fu;Sun-Lon Jen;Mei-hui Guo
義守大學	2001-07	Characterization of internal capacitors based on glass-added barium titanate	Lih-Shan Chen;Shen-Li Fu;Wen-Kuan Lin;Kwan-Dar Huang
義守大學	2001-01	Characterization of embedded spiral inductors in co-fired ceramic substrates	Lih-Shan Chen;Chi-Shiung Hsi;Shen-Li Fu;Jiuun-Yih Lin
國立中山大學	2001	Fuzzy thermal modeling for MCM placement	Yu-Jung Huang; Shen-Li Fu;Sun-Lon Jen; Mei-Hui Guo
義守大學	2000-11-05	Porosity development of RuO2 filled glass thick films on aluminum nitride substrates at elevated temperatures	Wenjea J. Tseng;Chir-Jang Tsai;Shen-Li Fu

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