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機構	日期	題名	作者
義守大學	2014-10	An experimental study on dicing 28 nm low-k water using laser grooving technique	Hsiang-Chen Hsu;Cheng-Jiun Han;Li-Ming Chu;Shih-Jeh Wu;Chih-Chiang Fu;Shen-Li Fu;Baojun Liu;Chen-Yi Wang;PoChun Jung
義守大學	2014-10	Cutting PCB with a 532nm DPSS green laser	Hsiang-Chen Hsu;Shih-Jeh Wu;Chih-Chiang Fu;Li-Ming Chu;Shen-Li Fu;Trong-Tai Nguyen
義守大學	2014-03	Numerical simulation of high power LED heat-dissipating system	Shih-Jeh Wu;Hsiang-Chen Hsu;Shen-Li Fu;Jiam-Nan Yeh
義守大學	2014-02	Failure analysis of EOS-induced damage at final electrical testing	Ming-Kun Chen;Yu-Jung Huang;Chi-Chan Cheng;Yi-Lung Lin;Shen-Li Fu
義守大學	2014-01	Reliability and Bondability Study on Interfacial Behavior between SnAgCu Solder and Cu-Ni-Au OSP Pads	Shen-Li Fu;Hsiang-Chen Hsu;Yue-Min Wan;Chi-Hau Haung
義守大學	2013-12	Application of a Flow Type Quartz Crystal Microbalance Immunosensor for Detection of Cartilage Oligomeric Matrix Protein and α1-Antitrypsin	Chi-Yen Shen;Yu-Chen Chiu;Ke-Nung Huang;Shen-Li Fu;Rey-Chue Hwang
義守大學	2013-10	Thermal design for high power arrayed LED heat-dissipating system	Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學	2013-10	Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis	Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學	2013-10	An investigation on nanoscale bondability between Cu-Al intermetallic compound	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學	2013-09	Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective	Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學	2013-07	A wireless system for measuring the vibration signals generated by knee joints	Jia-Jung Wang;Chun-Chien Chen;Shin-Hong Liu;Cheng-Yo Yen;Yuan-Kun Tu;Shen-Li Fu
義守大學	2013-07	Temperature feedback based heating strategy for ultrasound thermal surgery	Kuen-Cheng Ju;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-12	Implementing Cloud Technology Of NETPAW at I-Shou University	I-Lin Fu;Yuangshan Chuang;Shen-Li Fu;Robert Beasley
義守大學	2012-12	An investigation on secondary EFO copper wire - from a nanoscale perspective view	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
義守大學	2012-10	Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation	Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-04	Electronics Packaging Technology Research and Development in Taiwan	Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2012-02	The Perspectives of 3D IC Technology in Taiwan	Shen-Li Fu;Wei-Chung Lo;Ray-Lin Yang
義守大學	2011-11	Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates	Chung-Ming Wu;Shui-Hsiang Su;Hong-Tai Wang;Meiso Yokoyama;Shen-Li Fu
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Study of high dielectric constant capacitors on flexible substrates	Hung-Ming Chang;Meng-Lun Wu;Lih-Shan Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-09	Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings	Chih-Feng Wang;Wei-Yan Chen;Huy-Zu Cheng;Shen-Li Fu
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu
義守大學	2009/10/21	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu ; Shen-Wen Ju ; Jie-Rong Lu ; Shen-Li Fu
義守大學	2009-10	Floor plan design for 3D multi-layer substrate	Ching-Mai Ko;Yu-Jung Huang;Shen-Li Fu
義守大學	2009-10	Welcome message from Shen-Li Fu, conference co-chair	Shen-Li Fu
義守大學	2009-10	Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)	Hsiang-Chen Hsu; Shen-Wen Ju; Jie-Rong Lu; Shen-Li Fu;
義守大學	2009-10	Comprehensive Hygro-Thermo-Vapor Pressure Model for CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Lih-Shan Chen;Shen-Li Fu
義守大學	2009-03	Basic study of microwave evanescent coupling between parasitic elements on microstrip patch antenna array	Hsien-Chiao Teng;Yen-ting Yang;Shen Cherng;Yu-Jung Huang;Shen-Li Fu
義守大學	2008/12/09	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2008/10/22	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu;Yu-Teng Hsu ; Wen-Lo Hsich ; Meng-Chieh Weng ; Shao-Tang ZhangJian ; Feng-Jui Hsu ; Yi-Feng Chen ; Shen-Li Fu
義守大學	2008/10/22	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin ; Hung-Ming Chang ; Ching-Chien Yuan ; Yu-Jung Huang ; Lih-Shan Chen ; Hsiang-Chen Hsu ; Shen-Li Fu
義守大學	2008/10/22	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang ; Hsiang-Chen Hsu ; Shen-Li Fu ; Yi-Shao Lai ; Chang-Lin Yeh
義守大學	2008/01/24	Experimental approach to analyze failure site condition in final testing of bga package	Hsiang-Chen Hsu;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Application of organic thin film parasitic to patch antenna	Hsien-Chiao Teng;Shen Cherng;Anchi Yeh;Yu-Jung Huang;Shen-Li Fu
義守大學	2008-12	Characteristic of Heat Affected Zone for Ultra Thin Gold Wire/Copper Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai
義守大學	2008-11	Effect of oxide additives on the low-temperature sintering of dielectrics (Zn,Mg)TiO3	Ming-Liang Hsieh;Lih-Shan Chen;Hsiang-Chen Hsu;Shuming Wang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008-10	Fabrication and characterization of passive devices on flexible substrates	Pei-Ju Lin;Hung-Ming Chang;Ching-Chien Yuan;Yu-Jung Huang;Lih-Shan Chen;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-10	Effect of process parameters on the growth and properties of impurity-doped zinc oxide transparent conducting thin films by RF magnetron sputtering	Boen Houng; Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-10	Thermo-hygro-mechanical design and reliability analysis for CMOS image sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008-09	Effect of Ru addition on the properties of Al-doped ZnO thin films prepared by radio frequency magnetron sputtering on polyethylene terephthalate substrate	Chi Shiung Hsi;Boen Houng;Bing Yi Hou;Guo Ju Chen;Shen Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu
義守大學	2008-07	Low temperature sinterable (Zn,Mg)TiO3 microwave dielectrics	Lih-Shan Chen;Ming-Liang Hsieh;Hsiang-Chen Hsu;Shen-Li Fu

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