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機構	日期	題名	作者
義守大學	2013-12	Application of a Flow Type Quartz Crystal Microbalance Immunosensor for Detection of Cartilage Oligomeric Matrix Protein and α1-Antitrypsin	Chi-Yen Shen;Yu-Chen Chiu;Ke-Nung Huang;Shen-Li Fu;Rey-Chue Hwang
義守大學	2013-10	Thermal design for high power arrayed LED heat-dissipating system	Hsiang-Chen Hsu;Shih-Jeh Wu;Jyun-Yi Li;Jing-Wen Su;Jian-Siang Huang;Shen-Li Fu
義守大學	2013-10	Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis	Hsiang-Chen Hsu;Shih-Jeh Wu;Feng-Jui Hsu;Meng-Chieh Weng;Shen-Li Fu
義守大學	2013-10	An investigation on nanoscale bondability between Cu-Al intermetallic compound	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Li-Ming Chu;Shin-Pon Ju;Shen-Li Fu;Miin Shyan Bai
義守大學	2013-09	Further characterization of Pd-coated copper wire on wirebonding process: from a nanoscale perspective	Hsiang-Chen Hsu;Li-Ming Chu;Wei-Yao Chang;Yi-Feng Chen;Jih-Hsin Chien;Shen-Li Fu;Shin-Pon Ju;Wen-Jui Feng
義守大學	2013-07	A wireless system for measuring the vibration signals generated by knee joints	Jia-Jung Wang;Chun-Chien Chen;Shin-Hong Liu;Cheng-Yo Yen;Yuan-Kun Tu;Shen-Li Fu
義守大學	2013-07	Temperature feedback based heating strategy for ultrasound thermal surgery	Kuen-Cheng Ju;Shen-Li Fu
義守大學	2013-01	DESIGN AND FABRICATION OF ULTRA-THIN FLEXIBLE SUBSTRATE	Ming-Kun Chen;Yu-Jung Huang;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-12	Implementing Cloud Technology Of NETPAW at I-Shou University	I-Lin Fu;Yuangshan Chuang;Shen-Li Fu;Robert Beasley
義守大學	2012-12	An investigation on secondary EFO copper wire - from a nanoscale perspective view	Hsiang-Chen Hsu;Jih-Hsin Chien;Chen-Yi Wang;Cheng-Che Liu;Shen-Li Fu;Miin Shyan Bair
義守大學	2012-10	Nanoscale bondability study on copper-aluminum intermetallic compound using molecular dynamics simulation	Hsiang-Chen Hsu;Jih-Hsin Chien;Li-Ming Chu;Shin-Pon Ju;Yu-Ting Feng;Shen-Li Fu
義守大學	2012-10	Failure analysis of Cu electroplating process with Polyimide substrate fabricated for flexible packaging	Ying-Chih Wu;Yu-Jung Huang;Ming-Kun Chen;Yi-Lung Lin;Shen-Li Fu
義守大學	2012-04	Electronics Packaging Technology Research and Development in Taiwan	Shen-Li Fu;Wei-Chung Lo;Hsiang-Chen Hsu
義守大學	2012-02	3D Contactless Capacitive Coupled Interconnection Circuit Design	Yu-Jung Huang;Shen-Li Fu;Yi-Lung Lin;Ming-Kun Chen
義守大學	2012-02	The Perspectives of 3D IC Technology in Taiwan	Shen-Li Fu;Wei-Chung Lo;Ray-Lin Yang
義守大學	2011-11	Ultraviolet-Patternable Polymer Insulator for Organic Thin-Film Transistors on Flexible Substrates	Chung-Ming Wu;Shui-Hsiang Su;Hong-Tai Wang;Meiso Yokoyama;Shen-Li Fu
義守大學	2011-10	Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications	Sheng-Feng Hsiao;Ming-Kun Chen;Yi-Lung Lin;Yu-Jung Huang;Shen-Li Fu
義守大學	2011-10	An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate	Hsiang-Chen Hsu;Yu-Ming Wan;Chi-Hau Haung;Shen-Li Fu
義守大學	2011-10	A study on Nano-mechanical properties and nano-tribology for ultra-thin Pt-coated 4N copper wire	Hsiang-Chen Hsu;Jih-Hsin Chien;Shen-Li Fu
義守大學	2011-06	Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN CMOS Image Sensor	Hsiang-Chen Hsu;Li-Ming Chu;Shen-Li Fu
義守大學	2010-12	Advanced Finite Element Model on Copper Wire Ball Bonding	Hsiang-Chen Hsu;Hong-Shen Chang;Shu-Chi Tsao;Shen-Li Fu
義守大學	2010-10	Study of high dielectric constant capacitors on flexible substrates	Hung-Ming Chang;Meng-Lun Wu;Lih-Shan Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2010-10	Thermal aging effect on copper wire and micro interfacial frictional behavior along Cu FAB and Al pad	Hsiang-Chen Hsu;Chih-Chiang Fu;Hong-Shen Chang;Shen-Li Fu;Huang-Kuang Kung
義守大學	2010-09	Pressure-Proof Superhydrophobic Films from Flexible Carbon Nanotube/Polymer Coatings	Chih-Feng Wang;Wei-Yan Chen;Huy-Zu Cheng;Shen-Li Fu
義守大學	2010-08	Reliability analysis on electromigration and electro-thermo-mechanical for Sn4.0Ag0.5Cu solder ball	Hsiang-Chen Hsu;Jie-Rong Lu;Yue-Min Wan;Shen-Li Fu

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