臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Showing items 61-70 of 116 (12 Page(s) Totally)
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Institution	Date	Title	Author
義守大學	2008-05	Fabrication and properties evaluation of aluminum and ruthenium co-doped zinc oxide thin films	Boen Houng;Chi Shiung Hsi;Bing Yi Hou;Shen Li Fu
義守大學	2008-04	Harmonic suppression of bandpass filters using open-circuited stubs	Lih-Shan Chen;Wen-Jeng Lin;Tsung-Hui Huang;Mau-Phon Houng;Shen-Li Fu
義守大學	2008	Thermo-hygro-mechanical design and reliability analysis for CMOS Image Sensor	Hsiang-Chen Hsu;Hui-Yu Lee;Yu-Cha Hsu;Shen-Li Fu
義守大學	2008	An Investigation on Heat Affected Zone for Au Wire/Cu Wire and Advanced Finite Element Wirebonding Model	Wei-Yao Chang; Hsiang-Chen Hsu; Shen-Li Fu; Yi-Shao Lai; Chang-Lin Yeh
義守大學	2008	Hygroscopic Swelling Effect on Polymeric Materials and Thermo-hygro-mechanical Design on Finger Printer Package	Hsiang-Chen Hsu; Yu-Teng Hsu; Wen-Lo Hsich; Meng-Chieh Weng; Shao-Tang ZhangJian; Feng-Jui Hsu; Yi-Feng Chen; Shen-Li Fu
義守大學	2007/11/19	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu ; Wei-Yaw Chang ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007/10/01	Characteristic of heat affected zone in thin gold wire and dynamic transient analysis of wire bonding for microstructure of Cu/Low-K wafer	Pei-Chieh Chin ; Chin-Yuan Hu ; Hsiang-Chen Hsu ; Shen-Li Fu ; Chang-Lin Yeh ; Yi-Shao Lai
義守大學	2007-11	Study of contact degradation in final testing for BGA socket	Hsien-Chiao Teng;Ming-Kun Chen;Chia-Hao Yen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Planar antennas on flexible substrate for wireless applications	Hsien-Chiao Teng;Pei-Ju Lin;Ming-Kun Chen;Yu-Jung Huang;Shen-Li Fu
義守大學	2007-11	Dynamic finite element analysis on underlay microstructure of Cu/low-K wafer during bonding process	Hsiang-Chen Hsu; Wei-Yaw Chang; Shen-Li Fu; Chang-Lin Yeh; Yi-Shao Lai

Showing items 61-70 of 116 (12 Page(s) Totally)
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