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"shen wen wei"的相關文件
顯示項目 1-11 / 11 (共1頁)
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| 國立交通大學 |
2020-07-01T05:21:48Z |
An RDL-First Fan-out Wafer-level Package for Heterogeneous Integration Applications
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Lin, Yu-Min; Wu, Sheng-Tsai; Shen, Wen-Wei; Huang, Shin-Yi; Kuo, Tzu-Ying; Lin, Ang-Ying; Chang, Tao-Chih; Chang, Hsiang-Hung; Lee, Shu-Man; Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Chen, Kuan-Neng |
| 國立交通大學 |
2020-07-01T05:21:48Z |
Optimization of laser release process for throughput enhancement of fan-out wafer-level packaging
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Lee, Chia-Hsin; Su, Jay; Liu, Xiao; Wu, Qi; Lin, Jim-Wein; Lin, Puru; Ko, Cheng-Ta; Chen, Yu-Hua; Shen, Wen-Wei; Kou, Tzu-Ying; Huang, Shin-Yi; Lin, Ang-Ying; Lin, Yu-Min; Chen, Kuan-Neng |
| 國立交通大學 |
2019-04-03T06:37:05Z |
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
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Shen, Wen-Wei; Chen, Kuan-Neng |
| 國立政治大學 |
2019 |
政治與文學之間：1940年代台灣小說所反映「反現代」的原因及其意義
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沈文薇; Shen, Wen-Wei |
| 國立交通大學 |
2018-08-21T05:56:59Z |
Process Development and Material Characteristics of TSV-less Interconnection Technology for FOWLP
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Shen, Wen-Wei; Lin, Yu-Min; Chang, Hsiang-Hung; Kuo, Tzu-Ying; Fu, Huan-Chun; Lee, Yuan-Chang; Lee, Shu-Man; Lin, Ang-Ying; Huang, Shin-Yi; Chang, Tao-Chih; Lee, Alvin; Su, Jay; Huang, Baron; Bai, Dongshun; Liu, Xiao; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:29Z |
3-D Stacked Technology of DRAM-Logic Controller Using Through-Silicon Via (TSV)
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Shen, Wen-Wei; Lin, Yu-Min; Chen, Shang-Chun; Chang, Hsiang-Hung; Chang, Tao-Chih; Lo, Wei-Chung; Lin, Chien-Chung; Chou, Yung-Fa; Kwai, Ding-Ming; Kao, Ming-Jer; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:22Z |
Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology
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Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng |
| 國立交通大學 |
2018-08-21T05:53:17Z |
Uneven-Topography-Chip Packing Approach Using Double-Self-Assembly Technology for 3-D Heterogeneous Integration
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Shen, Wen-Wei; Chang, Hsiao-Chun; Yang, Yu-Tao; Hu, Yu-Chen; Chen, Kuan-Neng |
| 國立交通大學 |
2017-04-21T06:49:12Z |
Ultrathin Glass Wafer Lamination and Laser Debonding to Enable Glass Interposer Fabrication
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Shen, Wen-Wei; Chang, Hsiang-Hung; Wang, Jen-Chun; Ko, Cheng-Ta; Tsai, Leon; Wang, Bor Kai; Shorey, Aric; Lee, Alvin; Su, Jay; Bai, Dongshun; Huang, Baron; Lo, Wei-Chung; Chen, Kuan-Neng |
| 國立交通大學 |
2015-07-21T11:20:52Z |
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications
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Huang, Po-Tsang; Wu, Shang-Lin; Huang, Yu-Chieh; Chou, Lei-Chun; Huang, Teng-Chieh; Wang, Tang-Hsuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Tong, Ho-Ming |
| 國立交通大學 |
2015-07-21T08:31:30Z |
2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing Applications
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Huang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming |
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