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| 國立臺灣大學 |
2004-06 |
How to improve chip strength to avoid die cracking in a package
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Chen, Shoulung; Shih, I.G.; Chen, Y.N.; Tsai, C.Z.; Lin, J.W.; Wu, Enboa |
| 國立臺灣大學 |
2002-05 |
Influence of grinding process on semiconductor chip strength
|
Wu, Enboa; Shih, I.G.; Chen, Y.N.; Chen, S.C.; Tsai, C.Z.; Shao, C.A. |
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