| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
|
Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
|
Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; Kao, C. R.; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. |
| 臺大學術典藏 |
2022-09-21T23:30:33Z |
A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
|
Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution
|
Huang, J. H.; Shih, P. S.; Renganathan, V.; Grӓfner, S. J.; Chen, Y. A.; Huang, C. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; Kao, C. R. |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Highly uniform microfluidic electroless interconnections for chip stacking applications
|
Hung H.T;Ma Z.D;Shih P.S;Huang J.H;Kao L.Y;Yang C.Y;Renganathan V;Kao C.L;Hung Y.C;Kao C.R.; Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
|
Hung H.T;Yang S;Shih P.S;Ma Z.D;Huang J.H;Kao C.R.; Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-07-26T09:44:02Z |
Regulation of metE+ mRNA expression by FnrS small RNA in Salmonella enterica serovar Typhimurium
|
Chien C.-W;Chan Y.-F;Shih P.-S;Kuan J.-E;Wu K.-F;Wu C;Wu W.-F.; Chien C.-W; Chan Y.-F; Shih P.-S; Kuan J.-E; Wu K.-F; Wu C; Wu W.-F.; WHEI-FEN WU |
| 臺大學術典藏 |
2021-01-19T12:08:28Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
|
Hung, H. T.; Yang, S.; Shih, P. S.; Ma, Z. D.; Huang, J. H.; Kao, C. R. |
| 臺大學術典藏 |
2020-04-24T08:53:20Z |
Investigation of normal and superconducting states in noncentrosymmetric Re24Ti5
|
Lue, C.S.; Liu, H.F.; Kuo, C.N.; Shih, P.S.; Lin, J.-Y.; Kuo, Y.K.; Chu, M.W.; Hung, T.-L.; Chen, Y.Y. |
| 臺大學術典藏 |
2020-01-06T09:34:34Z |
Specific regions of the SulA protein recognized and degraded by the ATP-dependent ClpYQ (HslUV) protease in Escherichia coli
|
Chang C.-Y.;Weng Y.-T.;Hwang L.-Y.;Hu H.-T.;Shih P.-S.;Kuan J.-E.;Wu K.-F.;Wu W.-F.; Chang C.-Y.; Weng Y.-T.; Hwang L.-Y.; Hu H.-T.; Shih P.-S.; Kuan J.-E.; Wu K.-F.; Wu W.-F.; WHEI-FEN WU |
| 國立臺灣科技大學 |
2017 |
Reliability evaluation for an intermittent production system with stochastic number of normal machines
|
Lin, Y.-K.;Chang, P.-C.;Yeng, L.C.-L.;Shih, P.-S. |
| 國立交通大學 |
2014-12-08T15:30:14Z |
Investigation of normal and superconducting states in noncentrosymmetric Re24Ti5
|
Lue, C. S.; Liu, H. F.; Kuo, C. N.; Shih, P. S.; Lin, J-Y; Kuo, Y. K.; Chu, M. W.; Hung, T-L; Chen, Y. Y. |
| 國立成功大學 |
2013-05 |
Investigation of normal and superconducting states in noncentrosymmetric Re24Ti5
|
Lue, C. S.; Liu, H. F.; Kuo, C. N.; Shih, P. S.; Lin, J-Y; Kuo, Y. K.; Chu, M. W.; Hung, T-L; Chen, Y. Y. |
| 國立成功大學 |
2000-10 |
Effects of an interposed Mo layer on the interfacial reactions of Ti/Si0.76Ge0.24 by rapid thermal annealing and pulsed laser annealing
|
Huang, Jun-Chieh; Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 國立成功大學 |
2000-06 |
Interfacial reactions of Ni/Si0.76Ge0.24 and Ni/Si1-x-yGexCy by vacuum annealing and pulsed KrF laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 國立成功大學 |
2000-06 |
Pulsed KrF laser annealing of Mo/Si0.76Ge0.24
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S.; Chang, T. C. |
| 國立成功大學 |
2000-01 |
Annealing effects on the interfacial reactions of Ni on Si0.76Ge0.24 and Si1-x-yGexCy
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S.; Pan, F. M. |
| 國立成功大學 |
1999-07-16 |
Characterization of Si1-x-yGexCy films grown by C+ implantation and subsequent pulsed laser annealing
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S.; Pan, F. M.; Chang, T. C. |
| 國立成功大學 |
1999-06-01 |
Room temperature oxidation of Cu/Si0.76Ge0.24 annealed at 200 to 300 degrees C
|
Luo, Jian-Shing; Lin, Wen-Tai; Chang, C. Y.; Shih, P. S. |
| 淡江大學 |
1998-12-03 |
Crossflow microfiltration of deformable particles
|
Lu, W. M.; Tung, Kuo-lun; Pan, C. H.; Shih, P. S.; 黃國楨; Hwang, Kuo-jen |
