| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Thermal Compression Cu-Cu bonding using electroless Cu and the evolution of voids within bonding interface
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Huang, C. H.; Shih, P. S.; Huang, J. H.; Grafner, S. J.; Chen, Y. A.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:34Z |
Development of Cu-Cu Side-by-Side Interconnection Using Controlled Electroless Cu Plating
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Chen, Y. A.; Shih, P. S.; Chang, F. L.; Grafner, S. J.; Huang, J. H.; Huang, C. H.; Kao, C. R.; Lin, Y. S.; Hung, Y. C.; Kao, C. L.; Tarng, D. |
| 臺大學術典藏 |
2022-09-21T23:30:33Z |
A novel method of low temperature, pressureless interconnection for wafer level scale 3D packaging
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Shih, P. S.; Shen, C. H.; Chen, Y. A.; Huang, C. H.; Grafner, S. J.; Huang, J. H.; Kao, C. R. |
| 臺大學術典藏 |
2022-09-21T23:30:32Z |
Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution
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Huang, J. H.; Shih, P. S.; Renganathan, V.; Grӓfner, S. J.; Chen, Y. A.; Huang, C. H.; Kao, C. L.; Lin, Y. S.; Hung, Y. C.; Kao, C. R. |
| 臺大學術典藏 |
2022-03-22T08:30:21Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
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Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:30:20Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
|
Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2022-03-22T08:27:23Z |
Numerical analysis of an electroless plating problem in gas–liquid two-phase flow
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Wu P.-Y;Pironneau O;Shih P.-S;Kao C.R.; Wu P.-Y; Pironneau O; Shih P.-S; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Highly uniform microfluidic electroless interconnections for chip stacking applications
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Hung H.T;Ma Z.D;Shih P.S;Huang J.H;Kao L.Y;Yang C.Y;Renganathan V;Kao C.L;Hung Y.C;Kao C.R.; Hung H.T; Ma Z.D; Shih P.S; Huang J.H; Kao L.Y; Yang C.Y; Renganathan V; Kao C.L; Hung Y.C; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-08-05T02:40:45Z |
Effects of Isothermal Heat Treatment on Microstructure Evolution of Microfluidic Electroless Ni-P Interconnection Structure
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Hung H.T;Yang S;Shih P.S;Ma Z.D;Huang J.H;Kao C.R.; Hung H.T; Yang S; Shih P.S; Ma Z.D; Huang J.H; Kao C.R.; C. ROBERT KAO |
| 臺大學術典藏 |
2021-07-26T09:44:02Z |
Regulation of metE+ mRNA expression by FnrS small RNA in Salmonella enterica serovar Typhimurium
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Chien C.-W;Chan Y.-F;Shih P.-S;Kuan J.-E;Wu K.-F;Wu C;Wu W.-F.; Chien C.-W; Chan Y.-F; Shih P.-S; Kuan J.-E; Wu K.-F; Wu C; Wu W.-F.; WHEI-FEN WU |
