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"shih po cheng"
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| 淡江大學 |
20171014~20171016 |
An Efficient Automatic Traffic Sign Detection and Recognition Method for Smartphones.
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Shih, Po-Cheng;Tsai, Chi-Yi;Hsu, Chun-Fei |
| 國立成功大學 |
2008-03-20 |
IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls
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Lin, Kwang-Lung; Shih, Po-Cheng |
| 國立成功大學 |
2007-07-31 |
Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-04 |
Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-01 |
Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-11-13 |
錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究
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施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2006-11-13 |
錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究
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施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立臺中教育大學 |
2006 |
網路輔助問題本位學習之行動研究：以國小中年級自然與生活科技領域為例
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施柏成; Shih, Po-Cheng |
| 國立成功大學 |
2005-10 |
Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2005-01 |
Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows
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Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2003-06-18 |
錫銀銅系無鉛銲錫與Cu/Ni-P/Au基板之界面接合行為
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施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2003-06-18 |
錫銀銅系無鉛銲錫與Cu/Ni-P/Au基板之界面接合行為
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施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2003-01 |
Mechanical strength of Sn-3.5Ag-based solders and related bondings
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Chuang, Chiang-Ming; Shih, Po-Cheng; Lin, Kwang-Lung |
Showing items 1-14 of 14 (1 Page(s) Totally)
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