|
English
|
正體中文
|
简体中文
|
總筆數 :2826152
|
|
造訪人次 :
31818065
線上人數 :
920
教育部委託研究計畫 計畫執行:國立臺灣大學圖書館
|
|
|
"shih po cheng"的相關文件
顯示項目 1-10 / 14 (共2頁)
1 2 > >>
每頁顯示[10|25|50]項目
| 淡江大學 |
20171014~20171016 |
An Efficient Automatic Traffic Sign Detection and Recognition Method for Smartphones.
|
Shih, Po-Cheng;Tsai, Chi-Yi;Hsu, Chun-Fei |
| 國立成功大學 |
2008-03-20 |
IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls
|
Lin, Kwang-Lung; Shih, Po-Cheng |
| 國立成功大學 |
2007-07-31 |
Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-04 |
Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2007-01 |
Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立成功大學 |
2006-11-13 |
錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究
|
施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2006-11-13 |
錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究
|
施伯錚; Shih, Po-Cheng |
| 國立成功大學 |
2006-09-28 |
Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
| 國立臺中教育大學 |
2006 |
網路輔助問題本位學習之行動研究：以國小中年級自然與生活科技領域為例
|
施柏成; Shih, Po-Cheng |
| 國立成功大學 |
2005-10 |
Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste
|
Shih, Po-Cheng; Lin, Kwang-Lung |
顯示項目 1-10 / 14 (共2頁)
1 2 > >>
每頁顯示[10|25|50]項目
|
