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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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Institution Date Title Author
淡江大學 20171014~20171016 An Efficient Automatic Traffic Sign Detection and Recognition Method for Smartphones. Shih, Po-Cheng;Tsai, Chi-Yi;Hsu, Chun-Fei
國立成功大學 2008-03-20 IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls Lin, Kwang-Lung; Shih, Po-Cheng
國立成功大學 2007-07-31 Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow Shih, Po-Cheng; Lin, Kwang-Lung
國立成功大學 2007-04 Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste Shih, Po-Cheng; Lin, Kwang-Lung
國立成功大學 2007-01 Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C Shih, Po-Cheng; Lin, Kwang-Lung
國立成功大學 2006-11-13 錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究 施伯錚; Shih, Po-Cheng
國立成功大學 2006-11-13 錫-銀-銅銲錫接點中導入錫-鋅-鉍錫膏之界面反應、剪力和電性質研究 施伯錚; Shih, Po-Cheng
國立成功大學 2006-09-28 Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste Shih, Po-Cheng; Lin, Kwang-Lung
國立臺中教育大學 2006 網路輔助問題本位學習之行動研究:以國小中年級自然與生活科技領域為例 施柏成; Shih, Po-Cheng
國立成功大學 2005-10 Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste Shih, Po-Cheng; Lin, Kwang-Lung

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