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Institution Date Title Author
元智大學 2012-04 Lead-free Solders: Materials Reliability for Electronics Sinn-wen Chen; Wojciech Gierlotka; Hsin-jay Wu; Shih-kang Lin
元智大學 2012-04 Phase Diagrams and Their Applications in Pb-Free Soldering Sinn-wen Chen; Wojciech Gierlotka; Hsin-jay Wu; Shih-kang Lin
元智大學 2012-04 Phase Diagrams and Their Applications in Pb-Free Soldering Sinn-wen Chen; Wojciech Gierlotka; Hsin-jay Wu; Shih-kang Lin
元智大學 2012-04 Phase Diagrams and Their Applications in Pb-Free Soldering Sinn-wen Chen; Wojciech Gierlotka; Hsin-jay Wu; Shih-kang Lin
元智大學 2011-09-19 CALPHAD method and its application to lead – free solder materials Wojciech Gierlotka; Sinn-wen Chen; Hsin – jay Wu; Yu-Chih Huang
元智大學 2010-05 Phase equilibria and solidification of ternary Sn-Bi-Ag alloys Sinn-wen Chen; Hsin-Jay Wu; Yu-Chih Huang; Wojciech Gierlotka
元智大學 2010-05 Sn-Bi-Fe thermodynamic modeling and Sn-Bi/Fe interfacial reactions Yu-Chih Huang; Wojciech Gierlotka; Sinn-Wen Chen
元智大學 2010-05 Phase equilibria and solidification of ternary Sn-Bi-Ag alloys Sinn-wen Chen; Hsin-Jay Wu; Yu-Chih Huang; Wojciech Gierlotka
元智大學 2010-05 Sn-Bi-Fe thermodynamic modeling and Sn-Bi/Fe interfacial reactions Yu-Chih Huang; Wojciech Gierlotka; Sinn-Wen Chen
元智大學 2010-05 Phase equilibria and solidification of ternary Sn-Bi-Ag alloys Sinn-wen Chen; Hsin-Jay Wu; Yu-Chih Huang; Wojciech Gierlotka

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