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臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)
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2019臺灣學術機構典藏
研討會
機構典藏系統RC7版本已
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Institution Date Title Author
元智大學 2007-01 Solder Joint Reliablity Assessment for Flip Chip Ball Grid Array Components with Various Designs in Lead free Solder Materials and Solder Mask Dimensions 陳永樹; 王慶順; 王泰喬; 鄭武輝; K.C. Chang; T.D. Yuan
元智大學 2006-07 Influence of the Lead Free Solder Material and Solder Mask Dimensions on the FCBGA Components Reliability 陳永樹; C.S. Wang; T.C. Wang; W.H. Chan; K.C. Chang; T.D. Yuan

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