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Showing items 11-23 of 23  (1 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2009 Influence of power cycling durations on thermal and fatigue reliability characteristics of board-level chip-scale packages T.H. Wang;C.C. Lee;Y.S. Lai;K.Y. Lee
國立中山大學 2009 Coupled power and thermal cycling reliability of board-level package-on-package stacking assembly T.H. Wang;Y.S. Lai;C.C. Lee;Y.C. Lin
國立中山大學 2009 Numerical examinations of thermal cycling fatiguereliability of substrate through holes T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學 2009 Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學 2009 Numerical examinations of thermal cycling fatiguereliability of substrate through holes T.H. Chen;T.H. Wang;Y.S. Lai
國立中山大學 2009 Thermal characteristics evaluation for board-level high-performance flip-chip package equipped with vapor chamber T.H. Wang;C.C. Lee;R.T. Liu;Y.S. Lai
國立中山大學 2009 Effect of surface roughness of silicon dies and copper heat spreaders to the thermal performance of HFCBGAs T.H. Wang;S.N. Paisner;C.C. Lee;S. Chen;Y.S. Lai
國立中山大學 2009 High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests T.H. Wang;H.Y. Chen;C.C. Lee;Y.S. Lai
淡江大學 2008-03 Intelligent control of dynamic target tracking of a car-like wheeled robot in a sensor-network environment 翁慶昌 ; Wong, Ching-chang ; C.L. Hwang;T.H. Wang
國立高雄應用科技大學 2007 Analysis of the substrate effects of strain-hardening thin films on silicon under nanoindentation T.H.Wang; T.H.Fang; Y.C.Lin
元智大學 2005-04 A hybrid knowledge-based decision support system for enterprise mergers and acquisitions 王維康; W. Wen; T.H. Wang
輔英科技大學 2001-03-01 Antiinflammatory Activity Of Naphthylene Derivatives. 第十六屆生物醫學聯合學術年會, 台北,臺灣 T.H.Wang;M.H.Hwang;L.F.Liao;I.P.Wang;A.Y. Shen
國立中山大學 1999 Characterization of Porous Silicon Photovoltaic Device Through Rapid Thermal Oxidation,Rapid Thermal Annealing And HF-Dipping Processes M.K. Lee; T.H. Wang

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