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Showing items 41-50 of 202  (21 Page(s) Totally)
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Institution Date Title Author
臺大學術典藏 2018-09-10T15:00:30Z Signal integrity: Influence of non-linear driver, different bit rates, and estimation by different algorithms S.-Y. Hsu;C.-C. Chou;T.-L. Wu; S.-Y. Hsu; C.-C. Chou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:00:30Z Fast prediction of radiation from high-speed/high-density connectors H.-C. Chen;T.-L. Wu;S. Connor;B. Archambeault; H.-C. Chen; T.-L. Wu; S. Connor; B. Archambeault; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:00:30Z Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression C.-K. Shen;T.-L. Wu;C.-H. Chen;D.-H. Han; C.-K. Shen; T.-L. Wu; C.-H. Chen; D.-H. Han; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:00:30Z Statistical eye diagram prediction for a 8b10b-coded channel using pulse response C.-C. Chou;T.-L. Wu; C.-C. Chou; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T15:00:30Z Miniaturization technique for forward-wave directional couplers by using open stubs and patterned ground structures S.-K. Hsu;C.-C. Tseng;T.-L. Wu; S.-K. Hsu; C.-C. Tseng; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:41Z Radio-Frequency Interference Mitigation Strategies for High-Speed Connectors C.-Y. Hsiao;S.-H. Wang;C.-C Wang;W.-S. Wang;Y.-H. Lin;T.-L. Wu; C.-Y. Hsiao; S.-H. Wang; C.-C Wang; W.-S. Wang; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:40Z A Broadband Forward-Wave Directional Coupler Using Periodic Y-Shaped Ground Via Structures With Arbitrary Coupling Levels J.-C. Yen;S.-K. Hsu;T.-H. Lin;T.-L. Wu; J.-C. Yen; S.-K. Hsu; T.-H. Lin; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:40Z Model and mechanism of miniaturized and stopband-enhanced interleaved EBG structure for power/ground noise suppression C.-D. Wang;T.-L. Wu; C.-D. Wang; T.-L. Wu; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:40Z Overview of signal integrity and EMC design technologies on PCB:fundamentals and latest progress T.-L. Wu;F. Buesink;F. Canavero; T.-L. Wu; F. Buesink; F. Canavero; TZONG-LIN WU
臺大學術典藏 2018-09-10T09:50:40Z ABF-based TSV arrays with improved signal integrity on 3-D IC/interposers: equivalent models and experiments YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU; Y.-P. Chiou; T.-L. Wu; P.-S. Chen; W.-C. Lo; Y.-C. Lu; C.-D. Wang;Y.-J. Chang;Y.-C. Lu;P.-S. Chen;W.-C. Lo;Y.-P. Chiou;T.-L. Wu; C.-D. Wang; Y.-J. Chang

Showing items 41-50 of 202  (21 Page(s) Totally)
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