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Showing items 11-16 of 16  (1 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2004 Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integraged interconnect application T.C. Chang;T.M. Tsai;P.T. Liu;Y.C. Chang;J. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學 2004 Cu-penetration induced breakdown mechanism for a-SiCN C.W. Chen;P.T. Liu;T.C. Chang;J.H. Yang;T.M. Tsai;H.H. Wu;T.Y. Tseng
國立中山大學 2004 Investigation of the electrical properties and reliability of amorphous SiCN C.W. Chen;T.C. Chang;P.T. Liu;T.M. Tsai;C.H. Huang;J.M. Chen;T.Y. Tseng
國立中山大學 2004 Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學 2003 Direct Patterning of Low-k Hydrogen Silsesquioxane Using X-ray Exposure Technology T.C. Chang;T.M. Tsai;P.T. Liu;Y.S. Mor;C.W. Chen;J.T. Sheu;T.Y. Tseng
國立中山大學 2003 Moisture-induced material instability of porous organosilicate glass T.C. Chang;C.W. Chen;P.T. Liu;Y.S. Mor;H.M. Tsai;T.M. Tsai;S.T. Yan;C.H. Tu;T.Y. Tsing;S.M. Sze

Showing items 11-16 of 16  (1 Page(s) Totally)
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