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Showing items 11-19 of 19  (1 Page(s) Totally)
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Institution Date Title Author
國立中山大學 2005-05 Analytical Study of Thermal Modeling and Thermal Stress for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2005 Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2004-12 Thermal Modeling and Optimal Tool Moving Velocity for Friction Stir Welding C.H. Chien; T.P. Chen; Y.J. Chao
國立中山大學 2004-08 Nanoscale Measurement with Microscale Surface Resolution by Holographic Interferometry C.H. Chien; Y.D. Wu; C.C. Hsieh; Y.C. Chen; T.P. Chen; C.T. Wang
國立中山大學 2004-06-07 Investigations of the Mixed-mode Fracture of IC Package Interfaces C.H. Chien;Y.C. Chen; C.C. Hsieh; M.Y. Huang; Y.D. Wu; T.P. Chen
國立中山大學 2004-06-05 Hygro-Thermal Buckling And Warpage of An Initial Perfect Thin PBGA Package T.P. Chen; C.H. Chien
國立中山大學 2004-05-16 Hygro-Thermal Buckling Of A Thin PBGA Package C.H. Chien; T.P. Chen; Y.T. Chiou; C.C. Hsieh; Y.D. Wu; C.T. Wang
國立中山大學 2003 Influences of the Moisture Absorption on PBGA Package's Warpage During IR Reflow Process C.H. Chien; Y.C. Chen; Y.T. Chiou; T.P. Chen; C.C. Hsieh; J.J. Yan; W.Z. Chen; Y.D. Wu
國立中山大學 1991 Proximity effect of Pb on heavy-fermion CeCu6 T.P. Chen;Z.X. Zhao;H.D. Yang;E.L. Wolf;R.N. Shelton;P. Klavins

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