臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

	English \| 正體中文 \| 简体中文 \| Total items :0
	Visitors : 50704306 Online Users : 319 Project Commissioned by the Ministry of Education Project Executed by National Taiwan University Library

Scope

Adv. Search

Login

Administrator

臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

About TAIR
	About TAIR

Browse By
	Institution
	Author
	Title
	Date
	Statistics Chart
	Institution Facts
	Trend

News
	2019臺灣學術機構典藏研討會
	機構典藏系統RC7版本已發佈

Copyright
	Publisher & Journal Policy
	TAIR Copyright Conference Minutes

Related Links
	機構典藏計畫網站
	ROAR
	OpenDOAR
	SHERPA
	OAIster
	JAIRO
	Ira
	DSPACE
	RWWR
	臺大學術典藏NTU Scholars

"t t kuo"

Return to Browse by Author
Sorting by Title	Sort by Date

Showing items 1-11 of 11 (1 Page(s) Totally)
1
View [10|25|50] records per page

Institution	Date	Title	Author
元智大學	Mar-21	IMC microstructure modification and mechanical reinforcement of Sn-Ag-Cu/Cu microelectronic joints through an advanced surface finish technique	Cheng-En Ho; S. P. Yang; P. T. Lee; C. Y. Lee; C. C. Chen; T. T. Kuo
元智大學	Aug-20	Influence of Pd(P) Thickness on the Pd-free Solder Reaction between Eutectic Sn-Ag alloy and Au/Pd(P)/Ni(P)/Cu Multilayer	C. Y. Lee; S. P. Yang; C. H. Yang; M. K. Lu; T. T. Kuo; Cheng-En Ho
元智大學	2020/11/7	Morphological Transition of Cu6Sn5 and Cu3Sn Induced by Surface Finish and Its Mechanical Reliability of Solder Joints	C. H. Li; C. Y. Lee; S. P. Yang; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2020/10/21	Effects of Surface Finish on the Intermetallic Compound Formation and Mechanical Reliability of Microelectronic Solder Joints	C. H. Li; S. P. Yang; C. Y. Lee; C. C. Chen; T. T. Kuo; Cheng-En Ho
元智大學	2020/10/21	Electromagnetic Properties of Ni(P) and Its Signal Transmission Performance in 5G Communication Applications	W. L. Chou; H. W. Tseng; C. J. Yu; C. Y. Lee; Huei-Ru Fuh; T. T. Kuo; Chien-Chang Huang; Cheng-En Ho
元智大學	2013-02	Reliability Evaluation on a Submicron Ni(P) Thin Film for Lead-Free Soldering	Cheng-En Ho; C. W. Fan; W. H. Wu; T. T. Kuo
元智大學	2012-12	Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications	Cheng-En Ho; T. T. Kuo; Wojciech Gierlotka; F. M. Ma
元智大學	2012-12	Development and Evaluation of Direct Deposition of Au/Pd(P) Bilayers over Cu Pads in Soldering Applications	Cheng-En Ho; T. T. Kuo; Wojciech Gierlotka; F. M. Ma
元智大學	2012-10	Inhibiting the Growth of Cu3Sn and Kirkendall Voids in the Cu/Sn-Ag-Cu System by Minor Pd Alloying	Cheng-En Ho; T. T. Kuo; C. C. Wang; W. H. Wu
亞洲大學	2003	Ontology-based knowledge fusion framework using graph partitioning	T. T. Kuo;S. S. Tseng;Y. T. Lin

Showing items 1-11 of 11 (1 Page(s) Totally)
1
View [10|25|50] records per page