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Institution	Date	Title	Author
國立臺灣大學	2006-04	Capacities of soil to buffer acid rain in an alpine forest toposequence of central Taiwan	Zhuang, S.Y.; M.K. Wang, H.B. King, J.L. Hwong, K.C.Lin, C.H. Lai, F.S. Hsu; T.Y. Tseng
國立中山大學	2006	A Novel Fabrication of Germanium Nanocrystal Embedded in Silicon-Oxygen-Nitride Layer	C.H. Tu;T.C. Chang;P.T. Liu;H.C. Liu;C.F. Weng;J.H. Shy;B.H. Tseng;T.Y. Tseng;S.M. Sze;C.Y. Chang
國立中山大學	2005	Effects of oxygen plasma ashing on barrier dielectric SiCN film	C.W. Chen;T.C. Chang;P.T. Liu;T.S. Tsai;T.Y. Tseng
國立中山大學	2005	High performance hydrogenated amorphous Si TFT for AMLCD and AMOLED	C.W. Chen;T.C. Chang;P.T. Liu;T.Y. Tseng
國立中山大學	2005	Electrical degradation of n-channel poly-si TFT under AC stress	C.W. Chen;T.C. Chang;P.T. Liu;H.Y. Lu;C.F. Weng;C.W. Hu;T.Y. Tseng
國立中山大學	2004	Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integrated interconnect application	T.C. Chang;T.M. Tsai;P.T. Liu;S.T. Yan;Y.C. Chang;H. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學	2004	Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學	2004	CMP of Ultra Low-k Material Porous-Polysilazane (PPSZ) for Interconnect Applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學	2004	CMP of low-k methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;Y.C. Chang;T.Y. Tseng
國立中山大學	2004	CMP of ultra low-k material porous-polysilazane (PPSZ) for interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學	2004	CMP of ultra low-k Methylsilsesquiazane with oxygen plasma treatment for multilevel interconnect applications	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;S.T. Yan;H. Aoki;T.Y. Tseng
國立中山大學	2004	Method to improve chemical-mechanical-planarization polishing rate of low-k methyl-silsesquiazane for ultralarge scale integraged interconnect application	T.C. Chang;T.M. Tsai;P.T. Liu;Y.C. Chang;J. Aoki;S.M. Sze;T.Y. Tseng
國立中山大學	2004	Cu-penetration induced breakdown mechanism for a-SiCN	C.W. Chen;P.T. Liu;T.C. Chang;J.H. Yang;T.M. Tsai;H.H. Wu;T.Y. Tseng
國立中山大學	2004	Investigation of the electrical properties and reliability of amorphous SiCN	C.W. Chen;T.C. Chang;P.T. Liu;T.M. Tsai;C.H. Huang;J.M. Chen;T.Y. Tseng
國立中山大學	2004	Study on eching profile of nanoporous silica	C.W. Chen;T.C. Chang;P.T. Liu;T.S. Tsai;H.H. Wu;T.Y. Tseng
國立中山大學	2004	Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material	T.C. Chang;T.M. Tsai;P.T. Liu;C.W. Chen;T.Y. Tseng
國立中山大學	2004	Pattern profile distortion and stress evolution in nanoporous organosilicates after photoresist stripping	P.T. Liu;T.C. Chang;C.W. Chen;T.Y. Tseng
國立中山大學	2003	Direct Patterning of Low-k Hydrogen Silsesquioxane Using X-ray Exposure Technology	T.C. Chang;T.M. Tsai;P.T. Liu;Y.S. Mor;C.W. Chen;J.T. Sheu;T.Y. Tseng
中原大學	2002	A Model of Non-homogeneous Damped Electromagnetic Wave and Heat Equation in Ferrite Materials	M. J. Tung;Ricky Chen;C. H. Hsu;T. Y. Tseng
修平科技大學	1999	Mixing macro and micro flow time estimation model：wafer fab example	T.Y. Tseng;T.F. Ho;R. K. Li

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