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Showing items 1-10 of 19 (2 Page(s) Totally)
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| 國立交通大學 |
2016-03-28T00:05:44Z |
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
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Chang, Chih-Wei; Huang, Po-Tsang; Chou, Lei-Chun; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Lee, Yen-Chi; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming |
| 國立交通大學 |
2015-12-02T03:00:57Z |
Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Wu, Shang-Lin; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:54Z |
A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Cheng, Chuan-An; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2015-12-02T03:00:50Z |
Energy-Efficient Low-Noise 16-Channel Analog-Front-End Circuit for Bio-potential Acquisition
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Wu, Shang-Lin; Huang, Po-Tsang; Huang, Teng-Chieh; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2015-07-21T11:20:52Z |
2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications
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Huang, Po-Tsang; Wu, Shang-Lin; Huang, Yu-Chieh; Chou, Lei-Chun; Huang, Teng-Chieh; Wang, Tang-Hsuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Chiou, Jin-Chern; Hwang, Wei; Tong, Ho-Ming |
| 國立交通大學 |
2015-07-21T08:31:30Z |
2.5D Heterogeneously Integrated Bio-Sensing Microsystem for Multi-Channel Neural-Sensing Applications
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Huang, Po-Tsang; Chou, Lei-Chun; Huang, Teng-Chieh; Wu, Shang-Lin; Wang, Tang-Shuan; Lin, Yu-Rou; Cheng, Chuan-An; Shen, Wen-Wei; Chen, Kuan-Neng; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Cheng, Ming-Hsiang; Lin, Yueh-Lung; Tong, Ho-Ming |
| 國立交通大學 |
2015-07-21T08:31:17Z |
Energy-Efficient Configurable Discrete Wavelet Transform for Neural Sensing Applications
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Wang, Tang-Hsuan; Huang, Po-Tsang; Chen, Kuan-Neng; Chiou, Jin-Chem; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2015-07-21T08:29:00Z |
A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications
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Chang, Chih-Wei; Chou, Lei-Chun; Huang, Po-Tsang; Wu, Shang-Lin; Lee, Shih-Wei; Chuang, Ching-Te; Chen, Kuan-Neng; Hwang, Wei; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chiou, Jin-Chern |
| 國立交通大學 |
2014-12-08T15:35:47Z |
Area-Power-Efficient 11-Bit SAR ADC with Delay-Line Enhanced Tuning for Neural Sensing Applications
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Huang, Teng-Chieh; Huang, Po-Tsang; Wu, Shang-Lin; Chen, Kuan-Neng; Chiou, Jin-Chern; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chuang, Ching-Te; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:46Z |
Low Temperature (< 180 degrees C) Wafer-level and Chip-level In-to-Cu and Cu-to-Cu Bonding for 3D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
Showing items 1-10 of 19 (2 Page(s) Totally)
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