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"tong ho ming"的相关文件
显示项目 11-19 / 19 (共1页)
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| 國立交通大學 |
2014-12-08T15:35:46Z |
Multi-Layer Adaptive Power Management Architecture for TSV 3DIC Applications
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Chang, Ming-Hung; Hsieh, Wei-Chih; Wu, Pei-Chen; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Ting, Chun-Yen; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:44Z |
Near-/Sub-V-th Process, Voltage, and Temperature (PVT) Sensors with Dynamic Voltage Selection
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Chang, Ming-Hung; Lin, Shang-Yuan; Wu, Pei-Chen; Zakoretska, Olesya; Chuang, Ching-Te; Chen, Kuan-Neng; Wang, Chen-Chao; Chen, Kua-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Hwang, Wei |
| 國立交通大學 |
2014-12-08T15:35:19Z |
Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration
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Chien, Yu-San; Huang, Yan-Pin; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:16Z |
Low Temperature (< 180 degrees C) Bonding for 3D Integration
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Huang, Yan-Pin; Tzeng, Ruoh-Ning; Chien, Yu-San; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chuang, Ching-Te; Hwang, Wei; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:35:05Z |
A TSV-Based Bio-Signal Package With mu-Probe Array
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Chou, Lei-Chun; Lee, Shih-Wei; Huang, Po-Tsang; Chang, Chih-Wei; Chiang, Cheng-Hao; Wu, Shang-Lin; Chuang, Ching-Te; Chiou, Jin-Chern; Hwang, Wei; Wu, Chung-Hsi; Chen, Kuo-Hua; Chiu, Chi-Tsung; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:33:26Z |
Novel Cu-to-Cu Bonding With Ti Passivation at 180 degrees C in 3-D Integration
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Huang, Yan-Pin; Chien, Yu-San; Tzeng, Ruoh-Ning; Shy, Ming-Shaw; Lin, Teu-Hua; Chen, Kou-Hua; Chiu, Chi-Tsung; Chiou, Jin-Chern; Chuang, Ching-Te; Hwang, Wei; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration
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Chiang, Cheng-Hao; Hu, Yu-Chen; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立交通大學 |
2014-12-08T15:30:49Z |
Micro-masking Removal of TSV and Cavity during ICP Etching Using Parameter Control in 3D and MEMS Integrations
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Hu, Yu-Chen; Chiang, Cheng-Hao; Chen, Kuo-Hua; Chiu, Chi-Tsung; Chuang, Ching-Te; Hwang, Wei; Chiou, Jin-Chern; Tong, Ho-Ming; Chen, Kuan-Neng |
| 國立成功大學 |
2014 |
A study of chip-last embedded flip-chip package
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Chao, Shin-Hua; Tong, Ho-Ming; Hung, Chih-Pin; Lai, Yishao; Liu, Colin; Hsieh, Emma; Luh, Ding-Bang |
显示项目 11-19 / 19 (共1页)
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