|
|
???tair.name??? >
???browser.page.title.author???
|
"tsai szu ping"???jsp.browse.items-by-author.description???
Showing items 1-14 of 14 (1 Page(s) Totally)
1
View [10|25|50] records per page
| 國立交通大學 |
2019-04-03T06:44:27Z |
Effective Passivation With High-Density Positive Fixed Charges for GaN MIS-HEMTs
|
Liu, Shih-Chien; Huang, Chung-Kai; Chang, Chia-Hua; Lin, Yueh-Chin; Chen, Bo-Yuan; Tsai, Szu-Ping; Majlis, Burhanuddin Yeop; Dee, Chang-Fu; Chang, Edward Yi |
| 國立交通大學 |
2019-04-02T06:04:29Z |
An 80 nm In0.7Ga0.3As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
|
Wang, Chin-Te; Kuo, Chien-, I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2019-04-02T06:00:51Z |
Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs Using Active-Region Bumps-Induced Piezoelectric Effect
|
Tsai, Szu-Ping; Hsu, Heng-Tung; Chiang, Che-Yang; Tu, Yung-Yi; Chang, Chia-Hua; Hsieh, Ting-En; Wang, Huan-Chung; Liu, Shih-Chien; Chang, Edward Yi |
| 國立交通大學 |
2018-01-24T07:35:15Z |
利用覆晶構裝設計改善氮化鋁鎵/氮化鎵高電子遷移率電晶體之特性
|
蔡思屏; 張翼; Tsai, Szu-Ping |
| 國立交通大學 |
2017-04-21T06:55:16Z |
Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs by Strain Engineering Design
|
Tsai, Szu-Ping; Hsu, Heng-Tung; Wuerfl, Joachim; Chang, Edward Yi |
| 國立交通大學 |
2015-07-21T08:29:41Z |
Investigation of electrical and thermal properties of multiple AlGaN/GaN high-electron-mobility transistors flip-chip packaged in parallel for power electronics
|
Tsai, Szu-Ping; Hsu, Heng-Tung; Tu, Yung-Yi; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:48:37Z |
Design of Flip-Chip Interconnect Using Epoxy-Based Underfill Up to V-Band Frequencies With Excellent Reliability
|
Hsu, Li-Han; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Hu, Yin-Chu; Wang, Chin-Te; Wu, Yun-Chi; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:37:07Z |
An 80 nm In(0.7)Ga(0.3)As MHEMT with Flip-Chip Packaging for W-Band Low Noise Applications
|
Wang, Chin-Te; Kuo, Chien-I; Lim, Wee-Chin; Hsu, Li-Han; Hsu, Heng-Tung; Miyamoto, Yasuyuki; Chang, Edward Yi; Tsai, Szu-Ping; Chiu, Yu-Sheng |
| 國立交通大學 |
2014-12-08T15:36:34Z |
Performance Enhancement of Flip-Chip Packaged AlGaN/GaN HEMTs Using Active-Region Bumps-Induced Piezoelectric Effect
|
Tsai, Szu-Ping; Hsu, Heng-Tung; Chiang, Che-Yang; Tu, Yung-Yi; Chang, Chia-Hua; Hsieh, Ting-En; Wang, Huan-Chung; Liu, Shih-Chien; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:34:36Z |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
|
Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
|
Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
|
Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
| 國立交通大學 |
2014-12-08T15:14:33Z |
Preparation and characterization of thermal-sensitive ferrofluids for drug delivery application
|
Liu, Ting-Yu; Hu, Shang-Hsiu; Hu, Sheng-Hsiang; Tsai, Szu-Ping; Chen, San-Yuan |
| 國立成功大學 |
2014-01 |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
|
Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
Showing items 1-14 of 14 (1 Page(s) Totally)
1
View [10|25|50] records per page
|
