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Showing items 11-14 of 14 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:29:06Z |
Flip-Chip Packaging of In0.6Ga0.4As MHEMT Device on Low-Cost Organic Substrate for W-Band Applications
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Lim, Wee Chin; Wang, Chin-Te; Kuo, Chien-I; Hsu, Li-Han; Tsai, Szu-Ping; Chang, Edward Yi |
| 國立交通大學 |
2014-12-08T15:21:53Z |
Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
|
Hsu, Li-Han; Oh, Chee-Way; Wu, Wei-Cheng; Chang, Edward Yi; Zirath, Herbert; Wang, Chin-Te; Tsai, Szu-Ping; Lim, Wee-Chin; Lin, Yueh-Chin |
| 國立交通大學 |
2014-12-08T15:14:33Z |
Preparation and characterization of thermal-sensitive ferrofluids for drug delivery application
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Liu, Ting-Yu; Hu, Shang-Hsiu; Hu, Sheng-Hsiang; Tsai, Szu-Ping; Chen, San-Yuan |
| 國立成功大學 |
2014-01 |
Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
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Wang, Chin-Te; Hsu, Li-Han; Wu, Wei-Cheng; Hsu, Heng-Tung; Chang, Edward Yi; Hu, Yin-Chu; Lee, Ching-Ting; Tsai, Szu-Ping |
Showing items 11-14 of 14 (1 Page(s) Totally)
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