| 臺大學術典藏 |
2022-06-30T02:06:23Z |
Nano silicide formation in nano si wires
|
Tu K.N.; Lu K.-C.; Chou Y.-C.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:22Z |
Homogeneous nucleation of epitaxial CoSi 2 and NiSi in Si nanowires
|
Chou Y.-C.; Wu W.-W.; Chen L.-J.; Tu K.-N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:22Z |
Nucleation and growth of epitaxial silicide in nanowire of silicon
|
Chou Y.-C.; Lu K.-C.; Tu K.N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:21Z |
Growth of multiple metal/semiconductor nanoheterostructures through point and line contact reactions
|
Wu W.W.; Lu K.C.; Wang C.W.; Hsieh H.Y.; Chen S.Y.; Chou Y.C.; Yu S.Y.; Chen L.J.; Tu K.N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:21Z |
High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffraction
|
Chen K.; Tamura N.; Tang W.; Kunz M.; Chou Y.-C.; Tu K.N.; Lai Y.-S.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:20Z |
Heterogeneous and homogeneous nucleation of epitaxial NiSi2 in [110] Si nanowires
|
Chou Y.-C.; Wu W.-W.; Lee C.-Y.; Liu C.-Y.; Chen L.-J.; Tu K.-N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:20Z |
Nucleation and growth of epitaxial silicide in silicon nanowires
|
Chou Y.-C.; Lu K.-C.; Tu K.N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:18Z |
Formation of epitaxial silicide in silicon nanowires
|
Chou Y.-C.; Lu K.-C.; Tu K.-N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:18Z |
Core-Shell Effect on Nucleation and Growth of Epitaxial Silicide in Nanowire of Silicon
|
Chou Y.-C.; Tu K.-N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:16Z |
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
|
Chou Y.-C.; Tang W.; Chiou C.-J.; Chen K.; Minor A.M.; Tu K.N.; Chou Y.-C.; Tang W.; Chiou C.-J.; Chen K.; Minor A.M.; Tu K.N.; YI-CHIA CHOU |
| 臺大學術典藏 |
2022-06-30T02:06:08Z |
Fabrication and characteristics of highly ⟨ 110 ⟩ -oriented nanotwinned Au films
|
Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; Chiu W.-L.; Liu C.-M.; Lin H.-W.; Wu J.A.; Chou Y.-C.; Tu K.N.; Chen C.; YI-CHIA CHOU |
| 臺大學術典藏 |
2020-05-12T02:53:12Z |
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
|
TUNG-HAN CHUANG; Tu, K.N.; Chuang, T.H.; Lin, S.Z.; Wu, A.T.; Lin, W.H. |
| 國立交通大學 |
2020-05-05T00:01:29Z |
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
|
Chen, Chih; Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2020-02-02T23:55:32Z |
Low-resistance and high-strength copper direct bonding in no-vacuum ambient using highly (111)-oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Hsu, Po-Ning; Li, Yu Jin; Tu, K. N.; Chen, Chin |
| 國立交通大學 |
2020-01-02T00:04:23Z |
Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
|
Wang, I-Ju; Ku, Ching-Shun; Tu-Ngoc Lam; Huang, E-Wen; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:53Z |
Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-12-13T01:12:49Z |
Low-temperature Cu-to-Cu direct bonding enabled by highly (111)-oriented and nanotwinned Cu
|
Chen, Chih; Juang, Jing-Ye; Chang, Shih Yang; Shie, Kai Cheng; Li, Yu Jin; Tu, K. N. |
| 國立交通大學 |
2019-12-13T01:09:54Z |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
|
Huang, E-Wen; Chou, Hung-Sheng; Tu, K. N.; Hung, Wei-Song; Tu-Ngoc Lam; Tsai, Che-Wei; Chiang, Ching-Yu; Lin, Bi-Hsuan; Yeh, An-Chou; Chang, Shan-Hsiu; Chang, Yao-Jen; Yang, Jun-Jie; Li, Xiao-Yun; Ku, Ching-Shun; An, Ke; Chang, Yuan-Wei; Jao, Yu-Lun |
| 臺大學術典藏 |
2019-11-27T02:03:01Z |
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
|
C. ROBERT KAO;Tu K.N.;Kao C.R.;Lloyd J.R.;Tamura N.;Wu A.T.; Wu A.T.; Tamura N.; Lloyd J.R.; Kao C.R.; Tu K.N.; C. ROBERT KAO |
| 國立交通大學 |
2019-10-05T00:08:46Z |
A unified model of mean-time-to-failure for electromigration, thermomigration, and stress-migration based on entropy production
|
Tu, K. N.; Gusak, A. M. |
| 國立交通大學 |
2019-04-02T06:04:30Z |
Chip-to-chip copper direct bonding in no-vacuum ambient using (111) oriented nano-twinned copper
|
Juang, Jing Ye; Shie, Kai Cheng; Li, Yu Jin; Lin, Benson; Chang, Chia Cheng; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:50Z |
Correlation between the Microstructures of Bonding Interfaces and the Shear Strength of Cu-to-Cu Joints Using (111)-Oriented and Nanotwinned Cu
|
Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2019-04-02T06:00:47Z |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
|
Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
|
Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2019-04-02T06:00:16Z |
Stability of nanoscale twins in copper under electric current stressing
|
Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立臺灣科技大學 |
2019 |
Element Effects on High-Entropy Alloy Vacancy and Heterogeneous Lattice Distortion Subjected to Quasi-equilibrium Heating
|
Huang, E.-W.;Chou, H.-S.;Tu, K.N.;Hung, W.-S.;Lam, T.-N.;Tsai, C.-W.;Chiang, Chiang C.-Y.;Lin, B.-H.;Yeh, A.-C.;Chang, S.-H.;Chang, Y.-J.;Yang, J.-J.;Li, X.-Y.;Ku, C.-S.;An, K.;Chang, Y.-W.;Jao, Y.-L. |
| 國立交通大學 |
2018-08-21T05:53:51Z |
Comparison of oxidation in uni-directionally and randomly oriented Cu films for low temperature Cu-to-Cu direct bonding
|
Tseng, Chih-Han; Tu, K. N.; Chen, Chih |
| 國立交通大學 |
2018-08-21T05:53:03Z |
Growth competition between layer-type and porous-type Cu3Sn in microbumps
|
Chu, David T.; Chu, Yi-Cheng; Lin, Jie-An; Chen, Yi-Ting; Wang, Chun-Chieh; Song, Yen-Fang; Chiang, Cheng-Cheng; Chen, Chih; Tu, K. N. |
| 國立臺灣科技大學 |
2018 |
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
|
Juang J.-Y.; Lu C.-L.; Chen K.-J.; Chen C.-C.A.; Hsu P.-N.; Chen C.; Tu K.N. |
| 國立交通大學 |
2017-04-21T06:56:29Z |
Flux-driven cellular precipitation in open system to form porous Cu3Sn
|
Gusak, Andriy M.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:55:29Z |
Communication-Formation of Porous Cu3Sn by High-Temperature Current Stressing
|
Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:52Z |
In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration
|
Liao, Chien-Neng; Chen, Kuan-Chia; Wu, Wen-Wei; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:40Z |
Electromigration in Pb-free solder bumps with Cu column as flip chip joints
|
Nah, Jae-Woong; Suh, J. O.; Tu, K. N.; Yoon, Seung Wook; Chong, Chai Tai; Kripesh, V.; Su, B. R.; Chen, Chih |
| 國立交通大學 |
2017-04-21T06:49:38Z |
LOW-TEMPERATURE AND LOW-PRESSURE DIRECT COPPER-TO-COPPER BONDING BY HIGHLY (111)-ORIENTED NANOTWINNED CU
|
Chen, Chih; Liu, Chien-Min; Lin, Han-Wen; Huang, Yi-Sa; Chu, Yi-Cheng; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:49:36Z |
In-situ TEM Study of Electromigration in Cu lines
|
Liao, C. N.; Chen, K. C.; Wu, W. W.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:31Z |
Low-temperature and low pressure copper-to-copper direct bonding enabled by creep on highly (111)-oriented Cu surfaces
|
Tseng, Chih-Han; Liu, Chien-Min; Lin, Han-wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2017-04-21T06:48:21Z |
Fabrication of (111) nanotwinned Cu and its applications in interconnects of microelectronic devices
|
Chen, Chih; Liu, Chien-Min; Lu, Tien-Lin; Lin, Han-wen; Chu, Yi-Cheng; Lu, Chia-Ling; Juang, Jing-Ye; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2015-12-02T02:59:12Z |
Effect of Elastic Strain Fluctuation on Atomic Layer Growth of Epitaxial Silicide in Si Nanowires by Point Contact Reactions
|
Chou, Yi-Chia; Tang, Wei; Chiou, Chien-Jyun; Chen, Kai; Minor, Andrew M.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:17Z |
Stability of nanoscale twins in copper under electric current stressing
|
Chen, Kuan-Chia; Wu, Wen-Wei; Liao, Chien-Neng; Chen, Lih-Juann; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:48:15Z |
Growth of Multiple Metal/Semiconductor Nanoheterostructures through Point and Line Contact Reactions
|
Wu, W. W.; Lu, K. C.; Wang, C. W.; Hsieh, H. Y.; Chen, S. Y.; Chou, Y. C.; Yu, S. Y.; Chen, L. J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:35:49Z |
Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
|
Liu, Chien-Min; Lin, Han-Wen; Chu, Yi-Cheng; Chen, Chih; Lyu, Dian-Rong; Chen, Kuan-Neng; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:31:05Z |
Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
|
Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:40Z |
The Influence of Surface Oxide on the Growth of Metal/Semiconductor Nanowires
|
Lu, Kuo-Chang; Wu, Wen-Wei; Ouyang, Hao; Lin, Yung-Chen; Huang, Yu; Wang, Chun-Wen; Wu, Zheng-Wei; Huang, Chun-Wei; Chen, Lih J.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:30:34Z |
Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints
|
Liang, Y. C.; Lin, H. W.; Chen, H. P.; Chen, C.; Tu, K. N.; Lai, Y. S. |
| 國立交通大學 |
2014-12-08T15:30:31Z |
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
|
Liang, Y. C.; Chen, C.; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:29:38Z |
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
|
Tu, K. N.; Hsiao, Hsiang-Yao; Chen, Chih |
| 國立交通大學 |
2014-12-08T15:29:18Z |
Thermomigration in solder joints
|
Chen, Chih; Hsiao, Hsiang-Yao; Chang, Yuan-Wei; Ouyang, Fanyi; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:24:15Z |
Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
|
Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:23:13Z |
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
|
Hsiao, Hsiang-Yao; Liu, Chien-Min; Lin, Han-Wen; Liu, Tao-Chi; Lu, Chia-Ling; Huang, Yi-Sa; Chen, Chih; Tu, K. N. |
| 國立交通大學 |
2014-12-08T15:22:41Z |
The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
|
Huang, Y. S.; Hsiao, H. Y.; Chen, Chih; Tu, K. N. |
