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Showing items 1-4 of 4 (1 Page(s) Totally)
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| 國立交通大學 |
2014-12-08T15:43:08Z |
Enhanced dopant activation and elimination of end-of-range defects in BF2+-implanted silicon-on-insulator by high-density current
|
Lin, HH; Cheng, SL; Chen, LJ; Chen, C; Tu, KN |
| 國立交通大學 |
2014-12-08T15:19:08Z |
Threshold current density of electromigration in eutectic SnPb solder
|
Yeh, YT; Chou, CK; Hsu, YC; Chen, C; Tu, KN |
| 國立交通大學 |
2014-12-08T15:18:38Z |
Electromigration in pb-free SnAg3.8Cu0.7 solder stripes
|
Hsu, YC; Chou, CK; Liu, PC; Chen, C; Yao, DJ; Chou, T; Tu, KN |
| 國立交通大學 |
2014-12-08T15:17:41Z |
Relieving the current crowding effect in flip-chip solder joints during current stressing
|
Liang, SW; Shao, TL; Chen, C; Yeh, ECC; Tu, KN |
Showing items 1-4 of 4 (1 Page(s) Totally)
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