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Showing items 201-205 of 205 (9 Page(s) Totally)
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| 臺大學術典藏 |
2003 |
Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al2O3 with Sn interlayers
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Liang, M.W.; Hsieh, T.E.; Chang, S.Y.; Chuang, T.H.; TUNG-HAN CHUANG |
| 臺大學術典藏 |
2002 |
Characterization of intermetallic compounds formed during the interfacial reactions of liquid Sn and Sn-58Bi solders with Ni substrates
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Tseng, Y.H.; Chan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chiu, M.Y.; Chang, S.Y. |
| 臺大學術典藏 |
2000 |
Diffusion bonding of a superplastic Inconel 718SPF superalloy by electroless nickel plating
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TUNG-HAN CHUANG; Chuang, T.H.; Chang, C.B.; Yeh, M.S. |
| 臺大學術典藏 |
1996 |
The oxidation behavior of Ni3Al-Zr alloys with various zirconium contents
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Pan, Y.C.; Chuang, T.H.; TUNG-HAN CHUANG; Chang, T.T. |
| 臺大學術典藏 |
1996 |
Technical Note: Relationship between Electrical Conductivity and Stress Corrosion Cracking Susceptibility of Al 7075 and Al 7475 Alloys
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Tsai, T.C.; Chuang, T.H.; TUNG-HAN CHUANG |
Showing items 201-205 of 205 (9 Page(s) Totally)
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