|
English
|
正體中文
|
简体中文
|
总笔数 :2818629
|
|
造访人次 :
28113104
在线人数 :
766
教育部委托研究计画 计画执行:国立台湾大学图书馆
|
|
|
"tung ic"的相关文件
显示项目 1-6 / 6 (共1页)
1
每页显示[10|25|50]项目
| 國立交通大學 |
2014-12-08T15:46:27Z |
Effects of O-2- and N2O-plasma treatments on properties of plasma-enhanced-chemical-vapor-deposition tetraethylorthosilicate oxide
|
Chen, YC; Yang, MZ; Tung, IC; Chen, MP; Feng, MS; Cheng, HC; Chang, CY |
| 國立交通大學 |
2014-12-08T15:46:08Z |
Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishing
|
Hu, TC; Chiu, SY; Dai, BT; Tsai, MS; Tung, IC; Feng, MS |
| 國立交通大學 |
2014-12-08T15:46:07Z |
Effects of methyl silsesquioxane electron-beam curing on device characteristics of logic and four-transistor static random-access memory
|
Lin, CF; Tung, IC; Feng, MS |
| 國立交通大學 |
2014-12-08T15:44:44Z |
Characterization of excimer-laser-annealed polycrystalline silicon films grown by ultrahigh-vacuum chemical vapor deposition
|
Chen, YC; Wu, YCS; Tung, IC; Chao, CW; Feng, MS; Chen, HC |
| 國立交通大學 |
2014-12-08T15:27:11Z |
A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
|
Chiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT |
| 國立交通大學 |
2014-12-08T15:27:05Z |
Study on chemical-mechanical polishing of low dielectric constant polyimide thin films
|
Tai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS |
显示项目 1-6 / 6 (共1页)
1
每页显示[10|25|50]项目
|
