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"tzong lin wu"
Showing items 241-250 of 260 (26 Page(s) Totally) << < 17 18 19 20 21 22 23 24 25 26 > >> View [10|25|50] records per page
| 臺大學術典藏 |
2018-09-10T04:15:29Z |
Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB
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J.-N. Hwang; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:40Z |
Crosstalk characterization of high-speed interconnects in time-domain
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C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:40Z |
NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground
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L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
The effect of test system impedance on measurements of ground bounce in printed circuit boards
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T.-L. Wu; Y.-H. Lin; J.-N. Huang; J.-J. Lin; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement
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Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB
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J.-N. Hwang; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2014 |
A novel 2.5-dimensional ultraminiaturized-element frequency selective surface
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Yu, Y.-M.;Chiu, C.-N.;Chiou, Y.-P.;Wu, T.-L.; Yu, Y.-M.; Chiu, C.-N.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU; YIH-PENG CHIOU |
| 臺大學術典藏 |
2013-08 |
The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors
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TZONG-LIN WU; B. Archambeault; T.-L. Wu; S. Connor; H.-C. Chen; H.-C. Chen;S. Connor;T.-L. Wu;B. Archambeault |
| 臺大學術典藏 |
2012-12 |
Design considerations for radio frequency 3DICs
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Y.-C. Tseng;C.-B. Chang;C.-K. Tang;C.-H. Cheng;Y.-C. Lu;K.-Y. Lin;T.-L. Wu;R.-B. Wu; Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU; TZONG-LIN WU; RUEY-BEEI WU; KUN-YOU LIN |
| 臺大學術典藏 |
2012 |
Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer
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Zheng, T.-Y.; Chuang, H.-H.; Wang, C.-D.; Chen, P.-S.; Kuo, T.-Y.; Zhan, C.-J.; Wu, S.-H.; Lo, W.-C.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chang, Y.-J.; YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU et al. |
Showing items 241-250 of 260 (26 Page(s) Totally) << < 17 18 19 20 21 22 23 24 25 26 > >> View [10|25|50] records per page
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