| 臺大學術典藏 |
2018-09-10T04:59:34Z |
Low cost and low electromagnetic interference packaging of optical transceiver modules
|
W.-H. Cheng; W.-C.Hung; C.-H. Lee; G.-L. Hwang; W.-S. Jou,; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:59:33Z |
Rigorous analysis of form birefrigence of fused fiber couplers
|
T.-L. Wu;H.-C. Chang; T.-L. Wu; H.-C. Chang; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:59:33Z |
Rigorous analysis of polarization dependence loss (PDL) for equilateral 3x3 fused fiber couplers
|
T.-L. Wu; H.-J. Ou; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:43Z |
Polarization and dispersion analysis of holey fibers with elliptical air holes through the vector boundary-element method
|
C.-H. Chao; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:43Z |
Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)
|
S.-T. Chen; C.-W. Tsai; S.-M. Wu; C.-P. Hung,; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:43Z |
Electromagnetic shielding of plastic packaging in cost-effective optical transceiver modules
|
W.-H. Cheng; T.-L. Wu; W.-S. Jou; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:43Z |
Photonic crystal fiber analysis through vector boundary-element method
|
C.-H. Chao and T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:43Z |
A novel periodic structures in photonic crystal fibers
|
J.-S. Chiang; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:42Z |
Effective electromagnetic shielding of plastic packaging in low-cost optical transceiver modules
|
T.-L. Wu; W.-S. Jou; S.-G. Dai; W.-H. Cheng; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:42Z |
A vector power coupling model for analyzing polarization dependent loss (PDL) of equilateral triangular 3x3 weakly fused fiber couplers
|
T.-L. Wu; H.-J. Ou; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:42Z |
A novel systematic approach for equivalent model extraction of embedded high-speed interconnects in time domain
|
T.-L. Wu; C.-C. Kuo; H.-C. Chang; J.-S. Shie; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:35:42Z |
Time-domain SPICE model for coupled interconnects using the multi-conductor layer peeling technique
|
C.-C. Kuo; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:15:29Z |
The influence of fiber orientation on electromagnetic shielding in liquid crystal polymers
|
W.-S. Jou; T.-L. Wu; S.-K. Chiu; W.-H. Cheng; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:15:29Z |
A time-domain approach to extract SPICE-compatible equivalent models for embedded interconnects
|
H.-C. Chang; C.-C. Kuo; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:15:29Z |
NSTL evaluation of the compact EMC chamber with ferrite tiles being partially lined on the floor ground
|
L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T04:15:29Z |
Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB
|
J.-N. Hwang; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:40Z |
Crosstalk characterization of high-speed interconnects in time-domain
|
C.-C. Kuo; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:40Z |
NSTL evaluation of the compact EMC chamber with absorbers being partially lined on the floor ground
|
L.-R. Chen; Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
The effect of test system impedance on measurements of ground bounce in printed circuit boards
|
T.-L. Wu; Y.-H. Lin; J.-N. Huang; J.-J. Lin; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement
|
Y.-H. Lin; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2018-09-10T03:50:39Z |
The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB
|
J.-N. Hwang; T.-L. Wu; TZONG-LIN WU |
| 臺大學術典藏 |
2014 |
A novel 2.5-dimensional ultraminiaturized-element frequency selective surface
|
Yu, Y.-M.;Chiu, C.-N.;Chiou, Y.-P.;Wu, T.-L.; Yu, Y.-M.; Chiu, C.-N.; Chiou, Y.-P.; Wu, T.-L.; TZONG-LIN WU; YIH-PENG CHIOU |
| 臺大學術典藏 |
2013-08 |
The effect of various skew compensation strategies on mode conversion and radiation from high-speed connectors
|
TZONG-LIN WU; B. Archambeault; T.-L. Wu; S. Connor; H.-C. Chen; H.-C. Chen;S. Connor;T.-L. Wu;B. Archambeault |
| 臺大學術典藏 |
2012-12 |
Design considerations for radio frequency 3DICs
|
Y.-C. Tseng;C.-B. Chang;C.-K. Tang;C.-H. Cheng;Y.-C. Lu;K.-Y. Lin;T.-L. Wu;R.-B. Wu; Y.-C. Tseng; C.-B. Chang; C.-K. Tang; C.-H. Cheng; Y.-C. Lu; K.-Y. Lin; T.-L. Wu; R.-B. Wu; YI-CHANG LU; TZONG-LIN WU; RUEY-BEEI WU; KUN-YOU LIN |
| 臺大學術典藏 |
2012 |
Low slow-wave effect and crosstalk for low-cost ABF-coated TSVs in 3-D IC interposer
|
Zheng, T.-Y.; Chuang, H.-H.; Wang, C.-D.; Chen, P.-S.; Kuo, T.-Y.; Zhan, C.-J.; Wu, S.-H.; Lo, W.-C.; Lu, Y.-C.; Chiou, Y.-P.; Wu, T.-L.; Chang, Y.-J.; YI-CHANG LU; TZONG-LIN WU; YIH-PENG CHIOU et al. |
