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| 朝陽科技大學 |
2017-07 |
Effects of Electrical Current and External Stress on the Electromigration of Intermetallic Compounds Between the Flip-Chip Solder and Copper Substrate
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Chen, Wei-Jhen; Lee, Yue-Lin; Wu, Ti-Yuan; Tzu-Cing, Chen; Hsu, Chih-Hui; Lin, Ming-Tzer |
| 朝陽科技大學 |
2016-11 |
Viscoelastic mechanical properties measurement of thin Al and Al–Mg films using bulge testing
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Huang, An-Wen; Lu, Cheng-Hua; Wu, Shao-Chi; Tzu-Cing, Chen; Vinci, Richard P.; Brown, Walter L.; Lin, Ming-Tzer |
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