臺灣學術機構典藏系統 (Taiwan Academic Institutional Repository, TAIR)

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Institution	Date	Title	Author
臺大學術典藏	2021-12-06T09:02:53Z	The analyses and verification of in-vivo animal tests on the CMOS bone-guided cochlear implant microsystem	X.H. Qian; Y.C. Wu; T.Y. Yang; C.H. Cheng; H.C. Chu; W.H. Cheng; T.Y. Yen; T.H. Lin; Y.J. Lin; Y.C. Lee; J.H. Chang; S.T. Lin; S.H. Li; T.C. Wu; C.C. Huang; C.F. Lee; C.H. Yang; C.C. Hung; T.S. Chi; C.H. Liu; M.D. Ker; C.Y. Wu; CHIEN-HAO LIU
臺大學術典藏	2018-09-10T07:42:35Z	Combined 2-D Sound Source Localization with Stereo Vision for Intelligent Human-Robot Interaction of Service Robot	Ren C. Luo;W. H. Cheng;C. H. Huang; Ren C. Luo; W. H. Cheng; C. H. Huang; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T07:42:33Z	Combined 3-D Sound Source Localization with Stereo Vision for Intelligent Human-Robot Interactions of Service Robots	R. C. Luo;W. H. Cheng;C. H. Huang; R. C. Luo; W. H. Cheng; C. H. Huang; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T07:42:33Z	Network-Based Multimodal Human-Robot Interactions in Ubiquitous Computing Environment	Ren C. Luo;J. W. Zhan;W. H. Cheng;N. W. Chang; Ren C. Luo; J. W. Zhan; W. H. Cheng; N. W. Chang; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T06:37:28Z	MEMS Based Microsensors for Monitoring Temperature Inside Core and Cavity of Intelligent Mold	R. C. Luo; Y. L. Pan; W. H. Cheng; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T06:37:27Z	Layered Manufacturing Using Selected Functional Graded Materials Structure	R. C. Luo; C. M. Liu; Z. W. Li; W. H. Cheng; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T06:37:27Z	Core and Cavity with Embedded MEMS based Microsensors for Desktop Manufacturing Automation	R. C. Luo; W. H. Cheng; Z. W. Li; C. M. Liu; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T06:02:59Z	Intelligent Direct Metallic Rapid Tooling with Embedded MEMS based Microsensors	R. C. Luo; Y. L. Pan; W. H. Cheng; REN-CHYUAN LUO
臺大學術典藏	2018-09-10T06:02:52Z	A high electromagnetic immunity plastic composite package for a 10-gb/s optical transceiver module	T.-L. Wu; M.-C. Lin; C.-W. Lin; W.-S. Jou; T.-T. Shih; W.-H. Cheng; TZONG-LIN WU
臺大學術典藏	2018-09-10T06:02:52Z	New package scheme of a 2.5Gb/s plastic tranceiver module employing mutiwall nanotubes for low electromagnetic interference	C.-M. Chang; J.-C. Chiu; W.-S. Jou; T.-L. Wu; W.-H. Cheng; TZONG-LIN WU

Showing items 1-10 of 148 (15 Page(s) Totally)
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